A3P1000-FG484I

The A3P1000-FG484I is a ProASIC3 FPGA from Microchip Technology, providing a reconfigurable logic solution in a 484-ball BGA package. It combines 24,576 logic elements with approximately 147,456 bits of embedded RAM and up to 300 I/O pins, packaged for surface-mount assembly.

Designed for applications that require significant on-chip logic, local memory, and a high I/O count within an industrial temperature range, the device delivers integration and predictable electrical characteristics for system designs operating from 1.425 V to 1.575 V.

Key Features

• Core / Logic  24,576 logic elements supporting implementation of custom digital logic functions and approximately 1,000,000 gates for complex designs.
• On-chip Memory  Approximately 0.147 Mbits (147,456 bits) of embedded RAM for buffering, state storage, and small lookup-table requirements.
• High I/O Count  Up to 300 I/O pins to interface with multiple peripherals, external devices, and system buses.
• Power Supply  Operates from a supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting  484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C and specified as Industrial grade for temperature-sensitive deployments.
• Compliance  RoHS-compliant construction for environmental and regulatory alignment.

Typical Applications

• Custom logic implementation  Use the device’s 24,576 logic elements to implement glue logic, state machines, and user-defined digital functions.
• I/O-intensive interfacing  Support multiple external peripherals and parallel interfaces with up to 300 general-purpose I/Os.
• On-chip buffering and state storage  Leverage approximately 0.147 Mbits of embedded RAM for FIFOs, small buffers, and lookup tables within system designs.

Unique Advantages

• Highly integrated logic and memory: 24,576 logic elements combined with embedded RAM reduce the need for external components and simplify board design.
• Substantial I/O capacity: 300 available I/O pins enable broad peripheral connectivity and flexible signal routing.
• Industrial temperature support: Rated from −40°C to 100°C for use in temperature-demanding environments.
• Compact BGA footprint: 484-BGA (23×23) package offers a dense, surface-mount solution for space-constrained layouts.
• Defined low-voltage operation: Narrow supply window (1.425 V to 1.575 V) supports predictable power budgeting and integration with compatible system rails.
• RoHS-compliant: Meets common environmental directives for lead-free manufacturing.

Why Choose A3P1000-FG484I?

The A3P1000-FG484I positions itself as a balanced reconfigurable device that combines a large logic element count, embedded RAM, and a high number of I/Os in an industrial-temperature, surface-mount BGA package. Its defined supply voltage and RoHS compliance make it suitable for designs that demand predictable electrical behavior and regulatory alignment.

This device is well suited for engineers and procurement teams seeking a Microchip Technology FPGA that provides on-chip resources for logic, memory, and interfacing, enabling compact, integrated system designs with industrial temperature capability.

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