A3P1000-FG484M

The A3P1000-FG484M is a ProASIC3 field programmable gate array from Microchip Technology designed for mission-critical and rugged embedded systems. It provides a balance of logic capacity, on-chip memory and high I/O count in a compact surface-mount 484-FPBGA package.

Key product characteristics include 24,576 logic elements (approximate), roughly 0.147 Mbits of embedded RAM (147,456 bits), 300 I/Os, a 1.425 V to 1.575 V core supply range, MIL-STD-883 qualification and a −55 °C to 125 °C operating range for military-grade applications.

Key Features

• Logic Capacity 24,576 logic elements (specified as 24,576 logic element cells and 1,000,000 gates) to implement complex digital functions and control logic.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) to support buffering, state storage and small-data processing tasks without external memory.
• I/O Density 300 I/O pins to accommodate wide peripheral connectivity, sensor interfaces and multi-channel signal routing.
• Package & Mounting 484-FPBGA (23 × 23) package, surface-mount mounting type, providing a compact footprint for space-constrained board designs.
• Power Core supply range from 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
• Qualification & Temperature Range Military grade with MIL-STD-883 qualification and an operating temperature range of −55 °C to 125 °C for deployment in demanding environments.
• Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Military and Aerospace Systems Suitable for control, interface and processing tasks in military-grade electronics where MIL-STD-883 qualification and wide temperature operation are required.
• Rugged Embedded Control Implementation of compact, high-reliability control and signal-processing subsystems that benefit from extended temperature range and military-level qualification.
• High-Density I/O Systems Systems requiring numerous external interfaces—such as multi-sensor arrays, communication front-ends or complex I/O routing—can leverage the 300 I/Os and abundant logic elements.
• Space-Constrained Board Designs The 484-FPBGA (23 × 23) surface-mount package enables integration into compact, weight- and volume-sensitive assemblies.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and a −55 °C to 125 °C operating range support deployment in demanding environments where reliability matters.
• High Logic Density: 24,576 logic elements and 1,000,000 gates provide the capacity to implement complex logic functions without external programmable devices.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage, simplifying BOM and board routing.
• Extensive I/O Count: 300 I/Os enable flexible interfacing to sensors, controllers and peripheral subsystems within a single device.
• Compact, Surface-Mount BGA: 484-FPBGA (23 × 23) packaging combines high density with a small board footprint suitable for compact system designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious sourcing and manufacturing processes.

Why Choose A3P1000-FG484M?

The A3P1000-FG484M positions itself as a military-qualified FPGA option that brings significant logic resources, on-chip memory and a high I/O count into a compact BGA package. Its specified supply range and wide operating temperature, together with MIL-STD-883 qualification, make it a practical choice for applications that require rugged performance and long-term reliability.

This device is well suited for design teams building rugged embedded controllers, military/aerospace subsystems or any application needing high logic density and extensive I/O in a surface-mount BGA footprint while maintaining environmental compliance.

Request a quote or submit an RFQ to check availability and pricing for the A3P1000-FG484M.