A3P1000-FGG144

The A3P1000-FGG144 is a ProASIC3 family FPGA IC from Microchip Technology, providing a mid-range fabric optimized for custom digital logic integration. It delivers approximately 24,576 logic elements, roughly 1,000,000 gates of usable logic and embedded memory capacity, packaged in a compact 144-LBGA surface-mount form factor.

Designed for commercial-temperature applications, the device is targeted at designs that require a balance of logic density, on-chip RAM, and a moderate number of I/O lines within a defined supply-voltage window.

Key Features

• Core Logic Density  Approximately 24,576 logic elements providing about 1,000,000 gates of logic capacity for implementing custom digital functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for local data buffering and state storage.
• I/O Count  97 general-purpose I/O pins to support a variety of external interfaces and peripheral connections.
• Power Supply  Operates from a specified core voltage range of 1.425 V to 1.575 V, enabling designs that require defined supply tolerances.
• Package and Mounting  Supplied in a 144-LBGA package (supplier device package: 144-FPBGA (13x13)) for surface-mount PCB assembly while minimizing board footprint.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature, suitable for standard commercial electronics environments.
• Regulatory Compliance  RoHS-compliant manufacturing status to meet common environmental and materials requirements.

Typical Applications

• Embedded Control  Implement custom control logic and state machines using the device's ~24,576 logic elements and 97 I/O lines for system-level integration.
• Custom I/O Interfaces  Bridge and adapt between different peripheral standards or provide protocol glue logic where moderate I/O and local RAM are required.
• Prototyping and Low- to Mid-Volume Production  Use the FPGA for proof-of-concept designs or production runs that benefit from reprogrammable logic and integrated memory resources.

Unique Advantages

• Balanced Logic and Memory:  The combination of roughly 24,576 logic elements and 147,456 bits of embedded RAM supports mid-complexity digital designs without external memory for many control and interface tasks.
• Compact, Surface-Mount Package:  The 144-LBGA (144-FPBGA) package enables a small PCB footprint while providing a practical pin count for I/O and power routing.
• Defined Supply Window:  A tightly specified core voltage range (1.425 V–1.575 V) helps maintain predictable power and timing behavior in deployed systems.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation to meet the environmental requirements of standard commercial applications.
• RoHS Compliant:  Conforms to RoHS material restrictions for easier integration into eco-conscious product lines.

Why Choose A3P1000-FGG144?

The A3P1000-FGG144 offers a practical balance of logic density, embedded memory, and I/O capacity in a compact surface-mount LBGA package, making it suited to commercial designs that require moderate gate count and local RAM. Its clear operating-voltage range and commercial temperature rating simplify system-level power and thermal planning.

Engineers and procurement teams seeking a Microchip Technology ProASIC3 FPGA for mid-complexity digital integration will find this part appropriate for applications that demand reprogrammable logic, a moderate number of I/O, and RoHS-compliant sourcing.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the A3P1000-FGG144.