A3P1000-FGG144M

The A3P1000-FGG144M is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It offers 24,576 logic elements, approximately 0.147 Mbits (147,456 bits) of on-chip RAM and a total of 1,000,000 gates with 97 I/O connections in a compact 144-LBGA package.

Qualified to MIL-STD-883 and rated for operation from −55 °C to 125 °C, this military-grade FPGA is specified for designs that require extended temperature capability, formal military qualification, and a high density of programmable logic in a surface-mount BGA footprint.

Key Features

• Core Logic — 24,576 logic elements and 1,000,000 gates provide programmable capacity for complex logic and control functions.
• Embedded Memory — Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffering, state storage, and lookup tables.
• I/O Count — 97 I/O pins to interface with peripherals, sensors, and system buses.
• Power Supply — Operates from 1.425 V to 1.575 V, enabling designs targeting this defined low-voltage domain.
• Package and Mounting — 144-LBGA package (supplier package: 144-FPBGA, 13 × 13) with surface-mount mounting for compact board layouts.
• Qualification and Reliability — Military grade with MIL-STD-883 qualification for high-reliability applications.
• Temperature Range — Rated for operation between −55 °C and 125 °C for extreme-environment deployment.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Defense and Military Electronics — Deploy programmable logic where MIL-STD-883 qualification and military-grade temperature performance are required.
• Aerospace Avionics — Use in avionics subsystems that demand extended temperature operation and qualified components.
• Rugged Embedded Controls — Compact 144-LBGA footprint and 97 I/Os support space-constrained, high-reliability embedded control systems.

Unique Advantages

• Qualified to MIL-STD-883: Provides formal military qualification for projects requiring documented reliability standards.
• Extended Temperature Capability: Operation from −55 °C to 125 °C supports deployment in harsh thermal environments.
• High Logic Density: 24,576 logic elements and 1,000,000 gates deliver substantial programmable capacity for complex designs.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM enables local buffering and state storage without external memory.
• Compact BGA Package: 144-LBGA / 144-FPBGA (13 × 13) allows dense board integration with surface-mount assembly.
• RoHS Compliant: Meets environmental regulatory requirements for lead-free assembly.

Why Choose A3P1000-FGG144M?

The A3P1000-FGG144M balances high programmable capacity with military-grade qualification and extended temperature performance. With 24,576 logic elements, approximately 147,456 bits of on-chip RAM and 97 I/Os in a compact BGA package, it is positioned for designs where reliability, density and defined low-voltage operation are key requirements.

This FPGA is suited to engineers and procurement teams building military, aerospace, and rugged embedded systems that require proven qualification (MIL-STD-883), wide operating temperatures, and a compact surface-mount package—delivering a programmable, scalable building block for long-life and high-reliability projects.

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