A3P1000-2FGG484M
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 302 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 147456 |
Overview of A3P1000-2FGG484M – ProASIC3 Field Programmable Gate Array (FPGA) IC, 24,576 logic elements, 300 I/O, 147,456-bit RAM, 484-BGA
The A3P1000-2FGG484M is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for applications that require a high density of logic and I/O in a compact ball-grid package. It integrates 24,576 logic elements, approximately 147,456 bits of on-chip RAM and up to 300 I/O pins, delivering a balanced mix of logic capacity and embedded memory for embedded and mission-critical designs.
Built and qualified for military use, this device meets MIL-STD-883 and operates over a wide temperature range (−55°C to 125°C), alongside a low-voltage supply window of 1.14 V to 1.575 V, making it suitable for rugged environments and applications that demand classified qualification and extended temperature performance.
Key Features
- Core Logic 24,576 logic elements (LABs/CLBs) and approximately 1,000,000 gates provide substantial on-chip programmable logic capacity for complex designs.
- Embedded Memory 147,456 bits of total on-chip RAM to support buffering, FIFOs, and local storage for packet handling, state machines, and data processing tasks.
- I/O Density Up to 300 I/O pins to support broad peripheral interfacing and multi-channel signal routing within a single FPGA package.
- Package 484-ball BGA (484-FPBGA, 23×23) surface-mount package for a compact footprint and high pin count in space-constrained board designs.
- Power Supports a nominal supply range of 1.14 V to 1.575 V, enabling designs that require low-voltage core operation.
- Qualification & Reliability Military grade with MIL-STD-883 qualification and operating temperature range from −55°C to 125°C for use in environments with stringent reliability requirements.
- Compliance RoHS compliant for adherence to modern environmental standards.
- Mounting Surface-mount device suitable for standard PCB assembly processes.
Typical Applications
- Defense & Aerospace Systems — MIL-STD-883 qualification and a −55°C to 125°C operating range make the device appropriate for military and aerospace electronic systems requiring qualified components.
- Rugged Embedded Control — High logic capacity and abundant I/O support complex control, signal processing, and interface functions in harsh operating conditions.
- High-Density I/O and Signal Routing — 300 I/O pins in a compact 484-BGA package enable dense peripheral and bus interfacing in constrained board layouts.
Unique Advantages
- Military-Grade Qualification: MIL-STD-883 qualification and a wide −55°C to 125°C temperature range provide component-level assurance for defense and other rugged applications.
- High Logic Integration: 24,576 logic elements and roughly 1,000,000 gates consolidate complex logic into a single device, reducing BOM count and board complexity.
- On-Chip Memory: Approximately 147,456 bits of embedded RAM reduces dependence on external memory for local buffering and state storage.
- Extensive I/O Count: Up to 300 I/O pins allow flexible interfacing to multiple peripherals, sensors, and high-speed buses.
- Compact, High-Pin Package: 484-FPBGA (23×23) package delivers high pin density in a compact footprint for space-constrained designs.
- Low-Voltage Core Operation: Operates from 1.14 V to 1.575 V to meet low-power core requirements and system power constraints.
Why Choose A3P1000-2FGG484M?
The A3P1000-2FGG484M positions itself as a high-density, military-qualified FPGA from Microchip Technology for applications that require substantial programmable logic, embedded memory, and a large number of I/O in a compact BGA package. Its combination of 24,576 logic elements, 147,456 bits of on-chip RAM, and MIL-STD-883 qualification makes it suited to designers focused on rugged, long-life systems where qualification and temperature resilience are key.
This device is appropriate for teams needing a single-chip solution that balances logic capacity, embedded memory, and I/O density while meeting military qualification requirements. Its package and electrical characteristics support integration into tightly constrained and power-conscious designs backed by a known semiconductor manufacturer.
Request a quote or submit your specification to receive pricing and availability for the A3P1000-2FGG484M. Our team can provide lead-time and ordering information to support your design schedule.

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