A3P1000-2FGG484M

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 302 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O300Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits147456

Overview of A3P1000-2FGG484M – ProASIC3 Field Programmable Gate Array (FPGA) IC, 24,576 logic elements, 300 I/O, 147,456-bit RAM, 484-BGA

The A3P1000-2FGG484M is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for applications that require a high density of logic and I/O in a compact ball-grid package. It integrates 24,576 logic elements, approximately 147,456 bits of on-chip RAM and up to 300 I/O pins, delivering a balanced mix of logic capacity and embedded memory for embedded and mission-critical designs.

Built and qualified for military use, this device meets MIL-STD-883 and operates over a wide temperature range (−55°C to 125°C), alongside a low-voltage supply window of 1.14 V to 1.575 V, making it suitable for rugged environments and applications that demand classified qualification and extended temperature performance.

Key Features

  • Core Logic 24,576 logic elements (LABs/CLBs) and approximately 1,000,000 gates provide substantial on-chip programmable logic capacity for complex designs.
  • Embedded Memory 147,456 bits of total on-chip RAM to support buffering, FIFOs, and local storage for packet handling, state machines, and data processing tasks.
  • I/O Density Up to 300 I/O pins to support broad peripheral interfacing and multi-channel signal routing within a single FPGA package.
  • Package 484-ball BGA (484-FPBGA, 23×23) surface-mount package for a compact footprint and high pin count in space-constrained board designs.
  • Power Supports a nominal supply range of 1.14 V to 1.575 V, enabling designs that require low-voltage core operation.
  • Qualification & Reliability Military grade with MIL-STD-883 qualification and operating temperature range from −55°C to 125°C for use in environments with stringent reliability requirements.
  • Compliance RoHS compliant for adherence to modern environmental standards.
  • Mounting Surface-mount device suitable for standard PCB assembly processes.

Typical Applications

  • Defense & Aerospace Systems — MIL-STD-883 qualification and a −55°C to 125°C operating range make the device appropriate for military and aerospace electronic systems requiring qualified components.
  • Rugged Embedded Control — High logic capacity and abundant I/O support complex control, signal processing, and interface functions in harsh operating conditions.
  • High-Density I/O and Signal Routing — 300 I/O pins in a compact 484-BGA package enable dense peripheral and bus interfacing in constrained board layouts.

Unique Advantages

  • Military-Grade Qualification: MIL-STD-883 qualification and a wide −55°C to 125°C temperature range provide component-level assurance for defense and other rugged applications.
  • High Logic Integration: 24,576 logic elements and roughly 1,000,000 gates consolidate complex logic into a single device, reducing BOM count and board complexity.
  • On-Chip Memory: Approximately 147,456 bits of embedded RAM reduces dependence on external memory for local buffering and state storage.
  • Extensive I/O Count: Up to 300 I/O pins allow flexible interfacing to multiple peripherals, sensors, and high-speed buses.
  • Compact, High-Pin Package: 484-FPBGA (23×23) package delivers high pin density in a compact footprint for space-constrained designs.
  • Low-Voltage Core Operation: Operates from 1.14 V to 1.575 V to meet low-power core requirements and system power constraints.

Why Choose A3P1000-2FGG484M?

The A3P1000-2FGG484M positions itself as a high-density, military-qualified FPGA from Microchip Technology for applications that require substantial programmable logic, embedded memory, and a large number of I/O in a compact BGA package. Its combination of 24,576 logic elements, 147,456 bits of on-chip RAM, and MIL-STD-883 qualification makes it suited to designers focused on rugged, long-life systems where qualification and temperature resilience are key.

This device is appropriate for teams needing a single-chip solution that balances logic capacity, embedded memory, and I/O density while meeting military qualification requirements. Its package and electrical characteristics support integration into tightly constrained and power-conscious designs backed by a known semiconductor manufacturer.

Request a quote or submit your specification to receive pricing and availability for the A3P1000-2FGG484M. Our team can provide lead-time and ordering information to support your design schedule.

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