A3P1000-2FGG256I

The A3P1000-2FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers 1,000,000 gates and 24,576 logic elements in a 256-LBGA package to support complex programmable logic implementations.

Designed for industrial-grade applications, the device includes 177 user I/Os, approximately 0.147 Mbits (147,456 bits) of on-chip RAM, a narrow core supply range of 1.425 V to 1.575 V, and an operating temperature range of −40°C to 100°C. The package is a surface-mount 256-LBGA (supplier device package: 256-FPBGA, 17×17).

Key Features

• Core Logic  1,000,000 gates with 24,576 logic elements provide a high-density programmable fabric for complex custom logic implementations.
• Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Capacity  177 user I/O pins to support a wide range of external interfaces and parallel/serial connectivity options.
• Power  Supported core voltage range: 1.425 V to 1.575 V to match system power rails and enable predictable power design.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FPBGA, 17×17) for compact, high-density PCB implementations.
• Temperature & Grade  Industrial-grade operation with an ambient temperature range from −40°C to 100°C, suitable for demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control  Industrial-grade temperature range and 177 I/Os enable interfacing with sensors, actuators, and control buses in factory and process automation systems.
• Communications equipment  High gate count and abundant logic elements support custom packet processing and protocol adaptation logic in network infrastructure devices.
• Embedded systems  On-chip RAM and dense logic resources allow implementation of custom peripherals, glue logic, and hardware-accelerated functions in embedded platforms.
• Test and measurement  Configurable I/O and logic density make the device suitable for timing-critical signal conditioning and data acquisition tasks.

Unique Advantages

• High integration density: 1,000,000 gates and 24,576 logic elements consolidate complex functions into a single FPGA, reducing component count and PCB area.
• Ample I/O availability: 177 user I/Os enable direct connections to a broad set of external devices and subsystems without additional multiplexing hardware.
• Industrial operation: Rated from −40°C to 100°C and supplied in a robust 256-LBGA package for reliable performance in harsh environments.
• Deterministic power envelope: Narrow recommended core supply range (1.425 V–1.575 V) supports predictable power budgeting and supply design.
• RoHS compliant: Meets environmental regulations for lead-free manufacturing.

Why Choose A3P1000-2FGG256I?

The A3P1000-2FGG256I positions itself as a high-density, industrial-grade programmable logic device offering a balance of logic capacity, embedded memory, and extensive I/O in a compact 256-LBGA footprint. Its specifications make it suitable for system designers requiring substantial programmable resources and robust environmental performance.

This device suits engineering teams developing industrial control, communications, embedded, or test and measurement hardware who need integrated logic, on-chip RAM, and wide I/O count with a proven packaging and compliance profile.

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