A3P1000-2FGG144

The A3P1000-2FGG144 is a ProASIC3 field programmable gate array (FPGA) supplied in a 144-LBGA package. This commercial-grade FPGA delivers a balance of logic capacity, on-chip memory, and I/O density for compact, low-voltage embedded system designs.

With around 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 97 I/O pins, the device targets commercial applications that require configurable logic, on-chip RAM, and a compact BGA footprint while operating within a defined commercial temperature and supply range.

Key Features

• Core & Logic Approximately 24,576 logic elements provide the programmable fabric needed for custom logic implementation and moderate-complexity designs.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for register storage, buffering, and small data tables.
• I/O Density 97 general-purpose I/O pins support a variety of peripheral interfacing and board-level connectivity.
• Gate Capacity Around 1,000,000 gates to describe overall integration density and partitioning of logic resources.
• Power Operates from a defined core supply range of 1.425 V to 1.575 V for systems with precise supply requirements.
• Package & Mounting 144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount package for compact PCB layouts and automated assembly.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS-compliant materials.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and glue-logic in compact, space-constrained devices requiring on-board reprogrammability.
• Interface and Protocol Bridging — Use the available I/O and programmable logic to translate or adapt signals between subsystems within commercial equipment.
• Prototyping and Evaluation — Rapidly iterate digital designs and validate algorithms with a mid-density FPGA fabric and on-chip RAM.
• Consumer Electronics — Integrate configurable control, peripheral management, or display/interface logic in consumer-focused products within the commercial temperature range.

Unique Advantages

• Well-balanced logic capacity: Approximately 24,576 logic elements enable moderate-complexity designs without excessive resource overhead.
• Compact BGA footprint: 144-LBGA (13×13 FPBGA) package helps minimize PCB area while supporting surface-mount production processes.
• Defined low-voltage operation: Narrow supply window (1.425 V–1.575 V) supports designs that require controlled core-voltage schemes.
• On-chip RAM for buffering: Approximately 0.147 Mbits of embedded memory reduces the need for small external memory in many control and data-path tasks.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose A3P1000-2FGG144?

The A3P1000-2FGG144 positions itself as a practical, commercial-grade FPGA option for designers needing a compact, surface-mount package with a solid mix of logic elements, embedded RAM, and I/O. Its 144-LBGA package and defined supply and temperature ranges make it suitable for space-conscious boards and production environments that align with commercial specifications.

This device is appropriate for teams developing configurable logic for consumer and commercial embedded products, interface bridging, and prototyping where predictable electrical and thermal parameters are required. The combination of logic capacity, on-chip memory, and I/O count offers designers the ability to reduce external components and streamline BOMs for mid-range applications.

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