A3P1000-2FG484M

The A3P1000-2FG484M is a ProASIC3-series Flash-based FPGA in a 484-BGA package designed for military-grade embedded applications. It provides a Flash FPGA architecture with Flash*Freeze technology and is qualified to MIL-STD-883.

With 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, 300 I/O pins and a 1,000,000-gate capability, the device targets high-reliability systems that require wide operating temperature and low-voltage supply operation.

Key Features

• Core / Architecture Flash-based ProASIC3 architecture with Flash*Freeze technology as described in the product datasheet.
• Logic Capacity 24,576 logic elements (logic cells) and approximately 1,000,000 gates for medium-density logic integration.
• Embedded Memory 147,456 total RAM bits — approximately 0.147 Mbits of on-chip embedded memory for data buffering and state storage.
• I/O 300 I/O pins to support a wide range of external interfaces and system connectivity.
• Power Core supply voltage range of 1.14 V to 1.575 V.
• Package and Mounting 484-ball BGA (484-FPBGA, 23×23) surface-mount package for compact PCB integration.
• Qualification & Grade Military grade device qualified to MIL-STD-883 and specified for extended temperature operation.
• Operating Temperature Range Rated for −55°C to 125°C for deployment in temperature-extreme environments.
• Regulatory RoHS compliant.

Typical Applications

• Military and Defense Systems Suitable for military-grade embedded logic where MIL-STD-883 qualification and wide temperature range are required.
• Aerospace Electronics Use in avionics and aerospace subsystems that need reliable, Flash-based FPGA logic across −55°C to 125°C.
• High-Reliability Control Systems Embedded control and interface functions that benefit from on-chip RAM, extensive I/O and a hardened Flash FPGA architecture.

Unique Advantages

• Military-Qualified Device qualified to MIL-STD-883, providing a documented qualification level for defense applications.
• Flash-Based Non-Volatile Architecture ProASIC3 Flash architecture with Flash*Freeze technology provides a non-volatile configuration approach as indicated in the datasheet.
• Wide Thermal Range Specified operation from −55°C to 125°C supports deployment in extreme-temperature environments.
• Compact, High-Pin Package 484-BGA (23×23) package delivers 300 I/O in a surface-mount footprint for dense PCB designs.
• Balanced Capacity 24,576 logic elements and approximately 0.147 Mbits of embedded memory support mid-range integration without external SRAM for many control and interface tasks.
• RoHS Compliant Meets RoHS requirements for compliance-conscious program procurement.

Why Choose A3P1000-2FG484M?

The A3P1000-2FG484M positions itself as a military-grade Flash FPGA solution combining mid-range logic capacity, on-chip RAM and extensive I/O in a compact 484-BGA package. Its MIL-STD-883 qualification and −55°C to 125°C operating range make it suitable for defense and aerospace applications that require proven qualification and thermal robustness.

This device is well suited for engineers specifying reliable, non-volatile FPGA logic in systems that operate at low core voltages (1.14 V to 1.575 V) and demand a balance of logic density, embedded memory and I/O capability within a surface-mount BGA footprint.

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