A3P1000-2FG484I

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 530 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of A3P1000-2FG484I – Field Programmable Gate Array, 300 I/O, 484‑BGA

The A3P1000-2FG484I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, delivering 24,576 logic elements and approximately 1,000,000 gates in a high-density package. It integrates on-chip memory and a large I/O complement for complex, reconfigurable logic implementations.

Targeted at industrial applications, the device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, providing reliable operation in demanding environments.

Key Features

  • Core Logic 24,576 logic elements (logic element cells) and approximately 1,000,000 gates to implement custom digital functions and control logic.
  • Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for data buffering, FIFOs, and small memory structures.
  • I/O Capacity 300 available I/O pins to support broad interface and peripheral connectivity in a single device.
  • Power Single-core supply operating between 1.425 V and 1.575 V to match system power domains.
  • Package & Mounting 484-ball BGA package (supplier device package: 484-FPBGA, 23 × 23) designed for surface-mount assembly and high I/O density.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
  • Environmental Compliance RoHS compliant to meet standard environmental requirements for electronic components.

Unique Advantages

  • High logic density: 24,576 logic elements and roughly 1,000,000 gates enable substantial on-chip digital integration, reducing the need for multiple discrete logic devices.
  • Significant on-chip memory: Approximately 0.15 Mbits of embedded RAM supports local buffering and state storage without external memory.
  • Large I/O count in a compact package: 300 I/O pins in a 484-BGA footprint deliver extensive connectivity while conserving board space.
  • Industrial temperature capability: Rated −40 °C to 100 °C to support deployment in industrial environments where extended temperature ranges are required.
  • Defined power domain: Narrow supply range (1.425–1.575 V) simplifies power-management planning for single-core implementations.
  • RoHS compliant: Conforms to common environmental regulations for easier product compliance and manufacturing.

Why Choose A3P1000-2FG484I?

The A3P1000-2FG484I balances logic capacity, on-chip memory, and high I/O count in a surface-mount 484-BGA package, making it a practical choice for industrial designs that require reconfigurable digital logic and reliable operation across a wide temperature range. Its defined supply requirements and RoHS compliance help streamline system design and manufacturing.

Backed by Microchip Technology, this FPGA is suitable for engineers and procurement teams seeking a programmable, industrial-grade device with clear, verifiable specifications for logic density, memory, I/O, and environmental tolerance.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P1000-2FG484I.

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