A3P1000-2FG256

The A3P1000-2FG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a balance of logic capacity, embedded memory, and I/O in a compact surface-mount package. It provides 24,576 logic elements and approximately 0.147 Mbits of on‑chip RAM to support custom digital logic, control, and interfacing tasks in commercial electronic products.

Designed for commercial-grade applications, the device combines a 1,000,000-gate fabric with 177 user I/O and a 256-LBGA (256-FPBGA, 17×17) package, making it suitable for space-constrained boards that require moderate logic density and a reliable supply voltage window.

Key Features

• Logic Capacity 24,576 logic elements (24576 logic element cells) and 1,000,000 gates deliver moderate-density programmable logic for complex glue logic, state machines, and custom functions.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, lookup tables, and local data storage.
• I/O Resources 177 user I/O pins to support multiple interfaces and direct connections to peripherals and sensors.
• Power Requirements Core supply range of 1.425 V to 1.575 V for defined operating conditions and predictable power behavior.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for commercial electronic assemblies.

Typical Applications

• Custom Logic and Interface Bridging Implement glue logic and protocol bridging that benefit from 24,576 logic elements and abundant I/O for multi‑signal connectivity.
• On‑board Control and Processing Use embedded RAM and logic capacity for embedded controllers, real-time control tasks, and moderate data-path processing.
• Compact Electronic Modules Integrate programmable logic into space-constrained assemblies using the 256-LBGA surface-mount package and 177 I/O.

Unique Advantages

• Balanced Logic and Memory: Combines 24,576 logic elements with approximately 0.147 Mbits of embedded memory to support both control logic and local data buffering without external RAM.
• High I/O Count: 177 user I/O pins reduce the need for external expanders and simplify board-level connectivity for multi-interface designs.
• Compact Surface-Mount Package: The 256-LBGA (256-FPBGA, 17×17) provides a small PCB footprint while accommodating a sizable logic fabric.
• Defined Supply Window: A specified core voltage range (1.425 V–1.575 V) supports predictable power design and stable operation.
• Commercial-Grade and RoHS Compliant: Suitable for commercial electronic products that require regulatory compliance and standard operating-temperature performance.

Why Choose A3P1000-2FG256?

The A3P1000-2FG256 occupies the mid-density segment of ProASIC3 FPGAs, offering a practical combination of logic elements, embedded memory, and I/O in a compact 256-LBGA package. Its 1,000,000-gate fabric and 24,576 logic elements make it well matched to commercial embedded systems and electronic modules that need programmable logic without excessive board area.

Engineers and purchasing teams looking for a RoHS-compliant, commercial-grade FPGA with a clear supply-voltage specification and 177 user I/O will find the A3P1000-2FG256 suited to designs that demand on‑board flexibility, integration, and repeatable electrical behavior.

Request a quote or submit an inquiry to receive pricing and availability for the A3P1000-2FG256.