A3P1000-1PQG208M

IC FPGA 154 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

Quantity 638 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFQFPNumber of I/O154Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits147456

Overview of A3P1000-1PQG208M – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

The A3P1000-1PQG208M is a ProASIC3 field programmable gate array from Microchip Technology, providing deterministic flash-based FPGA resources in a military-grade package. It combines approximately 24,576 logic elements with 147,456 bits of on-chip RAM and up to 154 I/O to support mid-density programmable logic designs that require MIL-STD-883 qualification and a wide operating temperature range.

Key Features

  • Logic Capacity  Approximately 24,576 logic elements (cells) and 1,000,000 gates to implement mid-density custom logic and control functions.
  • Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, FIFOs, and small data stores within the FPGA fabric.
  • I/O Count  154 user I/O pins to connect sensors, actuators, peripherals and external buses directly to the FPGA.
  • Power  Specified core supply range of 1.425 V to 1.575 V for the device core voltage requirements.
  • Package and Mounting  208-BFQFP (Supplier device package: 208-PQFP, 28×28) in a surface-mount format for PCB assembly.
  • Temperature and Grade  Military grade device qualified to MIL-STD-883 and rated for operation from −55°C to 125°C for demanding environments.
  • Regulatory Compliance  RoHS compliant to meet environmental and material restrictions.

Typical Applications

  • Military and Rugged Electronics  Use in systems that require MIL-STD-883 qualification and operation across −55°C to 125°C.
  • I/O-Intensive Control Systems  Interfaces multiple peripherals and field signals with 154 available I/O pins for control, monitoring, and data acquisition tasks.
  • Embedded Logic and Buffering  Implement mid-density custom logic functions and on-chip memory buffering using approximately 24,576 logic elements and 0.147 Mbits of embedded RAM.
  • Compact Board Designs  Deploy in space-constrained PCBs with the 208-BFQFP (28×28) surface-mount package.

Unique Advantages

  • Military Qualification: MIL-STD-883 qualification and a military grade rating support designs with rigorous reliability requirements.
  • Wide Temperature Range: Rated for −55°C to 125°C operation to maintain functionality in extreme environmental conditions.
  • Balanced Logic and Memory: Approximately 24,576 logic elements paired with 147,456 bits of embedded RAM enables integrated logic and on-chip data handling without external memory for many mid-density designs.
  • Substantial I/O Count: 154 I/O pins allow flexible interfacing with external devices, sensors, and buses.
  • Surface-Mount Packaging: 208-PQFP (28×28) surface-mount package supports standard PCB assembly processes while providing a compact footprint.
  • RoHS Compliant: Meets environmental material restrictions to support regulatory and procurement requirements.

Why Choose A3P1000-1PQG208M?

The A3P1000-1PQG208M is positioned for projects that need a military-qualified, mid-density FPGA with a substantial complement of logic elements, on-chip RAM, and a high I/O count. Its specified core voltage range and surface-mount 208-PQFP package make it suitable for compact, rugged designs that demand deterministic programmable logic within a defined voltage and thermal envelope.

Designed and supplied by Microchip Technology, this device offers a combination of integration, qualification, and environmental capability that supports long-term deployment in demanding applications where qualification and thermal tolerance are essential considerations.

Request a quote or submit an inquiry to our team to receive pricing and procurement information for the A3P1000-1PQG208M.

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