A3P1000-1PQG208M
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 638 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 147456 |
Overview of A3P1000-1PQG208M – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP
The A3P1000-1PQG208M is a ProASIC3 field programmable gate array from Microchip Technology, providing deterministic flash-based FPGA resources in a military-grade package. It combines approximately 24,576 logic elements with 147,456 bits of on-chip RAM and up to 154 I/O to support mid-density programmable logic designs that require MIL-STD-883 qualification and a wide operating temperature range.
Key Features
- Logic Capacity Approximately 24,576 logic elements (cells) and 1,000,000 gates to implement mid-density custom logic and control functions.
- Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, FIFOs, and small data stores within the FPGA fabric.
- I/O Count 154 user I/O pins to connect sensors, actuators, peripherals and external buses directly to the FPGA.
- Power Specified core supply range of 1.425 V to 1.575 V for the device core voltage requirements.
- Package and Mounting 208-BFQFP (Supplier device package: 208-PQFP, 28×28) in a surface-mount format for PCB assembly.
- Temperature and Grade Military grade device qualified to MIL-STD-883 and rated for operation from −55°C to 125°C for demanding environments.
- Regulatory Compliance RoHS compliant to meet environmental and material restrictions.
Typical Applications
- Military and Rugged Electronics Use in systems that require MIL-STD-883 qualification and operation across −55°C to 125°C.
- I/O-Intensive Control Systems Interfaces multiple peripherals and field signals with 154 available I/O pins for control, monitoring, and data acquisition tasks.
- Embedded Logic and Buffering Implement mid-density custom logic functions and on-chip memory buffering using approximately 24,576 logic elements and 0.147 Mbits of embedded RAM.
- Compact Board Designs Deploy in space-constrained PCBs with the 208-BFQFP (28×28) surface-mount package.
Unique Advantages
- Military Qualification: MIL-STD-883 qualification and a military grade rating support designs with rigorous reliability requirements.
- Wide Temperature Range: Rated for −55°C to 125°C operation to maintain functionality in extreme environmental conditions.
- Balanced Logic and Memory: Approximately 24,576 logic elements paired with 147,456 bits of embedded RAM enables integrated logic and on-chip data handling without external memory for many mid-density designs.
- Substantial I/O Count: 154 I/O pins allow flexible interfacing with external devices, sensors, and buses.
- Surface-Mount Packaging: 208-PQFP (28×28) surface-mount package supports standard PCB assembly processes while providing a compact footprint.
- RoHS Compliant: Meets environmental material restrictions to support regulatory and procurement requirements.
Why Choose A3P1000-1PQG208M?
The A3P1000-1PQG208M is positioned for projects that need a military-qualified, mid-density FPGA with a substantial complement of logic elements, on-chip RAM, and a high I/O count. Its specified core voltage range and surface-mount 208-PQFP package make it suitable for compact, rugged designs that demand deterministic programmable logic within a defined voltage and thermal envelope.
Designed and supplied by Microchip Technology, this device offers a combination of integration, qualification, and environmental capability that supports long-term deployment in demanding applications where qualification and thermal tolerance are essential considerations.
Request a quote or submit an inquiry to our team to receive pricing and procurement information for the A3P1000-1PQG208M.

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