A3P1000-2FG144I

The A3P1000-2FG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for industrial applications that require mid-to-high logic density and on-chip memory. As a flash-based FPGA offering 1,000,000 gates and 24,576 logic elements, it targets embedded control and signal-processing functions where integration, I/O capacity, and extended temperature operation are important.

Key architectural attributes include approximately 0.15 Mbits of embedded RAM, 97 user I/Os, and a compact 144-LBGA surface-mount package, making the device suitable for space-conscious industrial designs operating across a wide voltage and temperature range.

Key Features

• Core Logic 24,576 logic elements providing up to 1,000,000 gates for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM to support buffering, small data tables, and intermediate storage for custom logic.
• I/O Capacity 97 user I/Os to enable multiple peripheral interfaces, sensor connections, and board-level glue logic.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB implementations.
• Power Supply Specified core voltage range of 1.425 V to 1.575 V for predictable power budgeting and supply design.
• Temperature Range Industrial operating range from −40 °C to 100 °C to support harsh-environment deployments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Implement custom real-time control logic and interface bridging for factory automation within an industrial temperature envelope.
• Embedded Signal Processing Deploy mid-density processing pipelines where on-chip RAM and significant logic resources accelerate deterministic functions.
• Sensor and I/O Aggregation Aggregate and preprocess signals from multiple sensors or peripherals using the device’s 97 I/Os and programmable logic.
• Board-Level Glue and Custom Interfaces Replace multiple discrete components with a single programmable device to simplify board routing and integrate custom timing or protocol conversions.

Unique Advantages

• High logic density in a compact package: 24,576 logic elements and 1,000,000 gates in a 144-LBGA footprint reduce PCB area while supporting substantial custom logic.
• Balanced on-chip memory: Approximately 0.15 Mbits of embedded RAM supports buffering and local data storage without external memory for many control and preprocessing tasks.
• Generous I/O availability: 97 I/Os enable flexible interfacing to sensors, actuators, and host systems without needing additional I/O expanders.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployments in manufacturing, instrumentation, and other demanding environments.
• Surface-mount, industry-standard package: 144-LBGA (144-FPBGA, 13×13) supports automated assembly and dense PCB integration.
• Defined power envelope: Core supply defined between 1.425 V and 1.575 V for straightforward power-supply design and validation.

Why Choose A3P1000-2FG144I?

The A3P1000-2FG144I combines substantial logic capacity, embedded RAM, and nearly 100 I/Os in a compact surface-mount LBGA package tailored for industrial-grade applications. Its defined supply range and extended operating temperature make it well suited for embedded designs that require reliable, integrated programmable logic without sacrificing board space.

Choose this ProASIC3 FPGA when you need a balance of logic resources, on-chip memory, and I/O density for industrial control, signal processing, or board-level integration tasks—delivering a scalable building block for long-lived embedded systems.

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