A3P1000-2FG256I

The A3P1000-2FG256I is a ProASIC3 field programmable gate array from Microchip Technology, offering a high-density, non-volatile FPGA fabric for industrial applications. It provides a balance of logic capacity, embedded memory, and I/O count in a compact BGA package.

This device is targeted at designs that require up to 1,000,000 gates, abundant logic resources, and robust industrial temperature operation while maintaining RoHS compliance and surface-mount assembly compatibility.

Key Features

• Logic Capacity — 24,576 logic elements delivering up to 1,000,000 gates for complex programmable logic implementations.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for data buffering, state machines, and small lookup tables.
• I/O — 177 user I/O pins to support wide peripheral interfacing and system-level connectivity.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Power — Core supply voltage range of 1.425 V to 1.575 V to match system power rails.
• Industrial Temperature Rating — Specified operating range from −40°C to 100°C suitable for industrial environments.
• Compliance — RoHS compliant to support environmentally conscious manufacturing.

Unique Advantages

• Substantial Logic Density: 24,576 logic elements enable implementation of complex logic and state machines without external glue logic, reducing BOM and board area.
• Integrated On-Chip RAM: 147,456 bits of embedded RAM support local buffering and control structures, minimizing dependence on external memory.
• High I/O Count: 177 I/Os allow flexible interfacing to sensors, controllers, and peripherals for multi-function industrial designs.
• Industrial Temperature Support: Rated for −40°C to 100°C operation to withstand extended temperature ranges commonly required in industrial deployments.
• Compact BGA Footprint: 256-ball FPBGA (17×17) package provides a space-efficient solution for high-density circuit boards while supporting surface-mount assembly.
• Vendor Backing: Manufactured by Microchip Technology, offering procurement consistency for production designs.

Why Choose A3P1000-2FG256I?

The A3P1000-2FG256I positions itself as a high-density, industrial-grade FPGA solution for applications requiring substantial programmable logic, reasonable on-chip memory, and a high I/O count in a compact BGA package. Its specification set—1,000,000 gates, 24,576 logic elements, 177 I/Os, and industrial temperature operation—makes it suitable for demanding embedded and industrial control designs where board space and thermal range are key considerations.

Designed and supplied by Microchip Technology, this ProASIC3 device brings together measurable logic resources and practical packaging choices to support long-term production deployments with RoHS compliance and surface-mount manufacturing compatibility.

Request a quote or submit a purchasing inquiry to receive pricing and availability for the A3P1000-2FG256I. Our team will respond with order options and lead-time information to support your design and procurement needs.