A3P1000-2FG256M

The A3P1000-2FG256M is a ProASIC3 low-power flash FPGA from Microchip Technology, offered in a 256-LBGA (256-FPBGA, 17×17) package. It combines flash-based configuration with Microchip’s Flash*Freeze technology and is qualified to MIL-STD-883 for military-grade applications.

With 24,576 logic elements, approximately 0.15 Mbits of embedded memory and 177 user I/Os, this device targets applications requiring moderate logic capacity, high I/O density and extended environmental capability.

Key Features

• Core Logic  24,576 logic elements (cells) provide the primary programmable fabric for custom logic and control functions.
• Embedded Memory  Approximately 0.15 Mbits (147,456 bits) of on-chip RAM to support buffers, state storage and small data structures.
• I/O Density  177 user I/Os enable broad external connectivity and signal routing in a compact package.
• Logic Scale  Equivalent to 1,000,000 gates for mapping legacy gate-count requirements to the programmable fabric.
• Low-Voltage Supply  Operates from 1.14 V to 1.575 V, supporting low-voltage system designs.
• Package & Mounting  256-LBGA (256-FPBGA, 17×17) surface-mount package for高-density board layouts and automated assembly.
• Extended Temperature Range  Rated for -55°C to 125°C operational range to meet demanding thermal environments.
• Military Qualification  Qualified to MIL-STD-883 and supplied in a military grade variant for defense and aerospace use.
• Compliance  RoHS-compliant construction supports regulatory and assembly requirements.

Typical Applications

• Military and Defense Systems  Implement custom logic and interface functions in electronically rugged systems where MIL-STD-883 qualification is required.
• Avionics  Supports control and data-routing functions in airborne equipment with an operating range to -55°C to 125°C.
• Ruggedized Communications Equipment  Delivers programmable I/O density and logic capacity for protocol bridging and custom packet handling in harsh environments.
• Embedded Control and Data Processing  Provides logic resources and on-chip RAM for state machines, signal conditioning logic and deterministic control tasks.

Unique Advantages

• Military-grade qualification: MIL-STD-883 qualification and a -55°C to 125°C rating combine to support development for defense and aerospace platforms.
• Flash-based configuration with Flash*Freeze: Flash technology provides non-volatile configuration and the datasheet-identified Flash*Freeze capability for low-power operation.
• High I/O count in compact package: 177 I/Os in a 256-LBGA (17×17) package enable complex interfacing while conserving PCB area.
• Balanced logic and memory resources: 24,576 logic elements alongside approximately 0.15 Mbits of embedded RAM suit a wide range of mid-density logic and buffering needs.
• Low-voltage operation: 1.14 V to 1.575 V supply range supports integration into modern low-voltage system rails.
• Regulatory compliance: RoHS compliance aids design-for-manufacture and regulatory alignment for many programs.

Why Choose A3P1000-2FG256M?

The A3P1000-2FG256M positions itself as a mid-capacity, military-qualified flash FPGA that balances logic density, embedded memory and high I/O count in a compact 256-LBGA package. Its MIL-STD-883 qualification, extended temperature rating and flash-based configuration make it suitable for defense and aerospace programs that require documented device-level qualifications and reliable non-volatile configuration.

Design teams implementing custom control, routing and interface functions will find the combination of 24,576 logic elements, approximately 0.15 Mbits of RAM and 177 I/Os useful for reducing external components and consolidating functions into a single programmable device.

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