A3P1000-2FG144

The A3P1000-2FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for commercial-grade applications that require reconfigurable digital logic. It combines a substantial number of logic elements with embedded memory and a compact BGA package to support integration into space-constrained boards.

Key architectural attributes include 24,576 logic elements, approximately 0.15 Mbits of on-chip RAM, 97 I/O pins, and an operating supply range of 1.425 V to 1.575 V, with an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  24,576 logic elements provide substantial reconfigurable resource for complex combinational and sequential logic implementations.
• On-Chip Memory  Approximately 0.15 Mbits of embedded RAM for data buffering, state storage, and small lookup tables.
• I/O Resources  97 general-purpose I/O pins to interface with peripherals, sensors, and board-level signals.
• Gate Equivalent  Approximately 1,000,000 gates of logic equivalence for mapping larger HDL designs.
• Package and Mounting  144-ball LFBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor suitable for compact PCB layouts.
• Power Supply  Narrow core supply range of 1.425 V to 1.575 V to match system power rails and simplify power sequencing.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for deployment in commercial electronics environments.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and reduced hazardous substances.

Typical Applications

• Commercial Embedded Systems  Implement custom logic functions, glue-logic, and protocol handling in commercial electronic products.
• Interface and I/O Bridging  Use the device’s 97 I/O pins to consolidate peripheral interfaces or translate between board-level signals.
• Logic Consolidation  Replace multiple discrete glue-logic components with programmable logic to reduce BOM and simplify routing.

Unique Advantages

• High Logic Density: 24,576 logic elements enable integration of sizable digital functions into a single device.
• Embedded Memory for Local Storage: Approximately 0.15 Mbits of RAM supports on-chip buffering and state machines without external memory.
• Compact BGA Footprint: 144-ball FPBGA (13×13) package provides a small board area while maintaining a high pin count.
• Narrow Core Voltage Window: The defined 1.425 V–1.575 V supply simplifies power-rail design and helps ensure consistent operation within specified conditions.
• Commercial Grade Operation: Specified 0 °C to 85 °C temperature range aligns with typical commercial product requirements.
• RoHS Compliance: Conforms to environmental and assembly standards for lead-free manufacturing.

Why Choose A3P1000-2FG144?

The A3P1000-2FG144 positions itself as a versatile, commercial-grade FPGA option for designers who need substantial logic resources and on-chip memory in a compact BGA package. Its combination of 24,576 logic elements, approximately 0.15 Mbits of embedded RAM, and 97 I/Os makes it suitable for consolidating logic, handling interface tasks, and implementing custom control functions in commercial electronic products.

Choosing this device offers long-term design flexibility through reprogrammable logic, a clear specification set for power and temperature, and compliance with RoHS to support modern manufacturing requirements.

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