A3P1000-1PQG208I

The A3P1000-1PQG208I is a ProASIC3 field-programmable gate array (FPGA) from Microchip Technology, offered in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It provides a balance of logic density, on-chip memory, and I/O capacity for industrial embedded designs.

With 24,576 logic elements, approximately 0.15 Mbits of embedded memory, and 154 I/O pins, this device targets applications that require configurable logic, moderate embedded RAM, and operation across a wide temperature range down to –40°C.

Key Features

• Core / Logic: 24,576 logic elements (cells) delivering up to 1,000,000 gates of programmable logic capacity for custom digital functions and glue logic.
• Embedded Memory: Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for data buffering, small FIFOs, and state storage.
• I/O Capability: 154 user I/O pins to support multiple interfaces and system-level connectivity.
• Power Supply: Operates from a supply range of 1.425 V to 1.575 V to match system rail requirements.
• Package & Mounting: Supplied in a 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level integration.
• Temperature & Grade: Industrial-grade device rated for operation from –40°C to 100°C for deployment in demanding environments.
• Environmental Compliance: RoHS compliant for regulatory and assembly compatibility.

Typical Applications

• Industrial Control: Programmable logic and I/O density make the device suitable for motor control, PLCs, and factory automation where industrial temperature operation is required.
• Embedded Systems: Use as configurable glue logic, protocol bridging, or custom peripherals in embedded platforms that need moderate on-chip RAM and numerous I/Os.
• Communications Equipment: Implement interface adaptation, control plane logic, and custom packet handling functions leveraging the available logic and I/O resources.
• Test & Measurement: Create custom signal conditioning, data aggregation, and control logic for instrumentation with reliable operation across a wide temperature range.

Unique Advantages

• Industrial Temperature Support: Rated from –40°C to 100°C, enabling deployment in harsh or temperature-variable environments.
• High Logic Density: 24,576 logic elements and 1,000,000 gates provide substantial programmable capacity for complex custom logic.
• Substantial On-Chip Memory: Approximately 0.15 Mbits of embedded RAM supports buffering and state storage without external memory.
• Generous I/O Count: 154 I/O pins allow flexible interfacing with sensors, peripherals, and other system components.
• Compact Surface-Mount Package: 208-BFQFP (28×28) package balances board space with pin count for practical system integration.
• Regulatory Compatibility: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose A3P1000-1PQG208I?

The A3P1000-1PQG208I positions itself as a versatile industrial-grade FPGA option within the ProASIC3 family, combining a substantial count of logic elements, embedded RAM, and a high I/O pin count in a compact surface-mount package. Its supply voltage range and wide operating temperature make it suitable for robust embedded and industrial designs.

Designed for engineers who need configurable logic with on-chip memory and reliable operation, this Microchip Technology device supports a range of system integration tasks while maintaining compliance with RoHS requirements for production deployment.

Request a quote or submit an inquiry today to obtain pricing and availability for the A3P1000-1PQG208I.