A3P1000-1PQ208

The A3P1000-1PQ208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides approximately 24,576 logic elements, about 147,456 bits of embedded RAM, and an I/O count of 154 in a 208-BFQFP surface-mount package.

Designed for commercial-grade electronic designs, this device combines substantial logic capacity, on-chip memory and a high I/O density with a defined supply and operating range (1.425 V–1.575 V, 0 °C–85 °C) to support a variety of programmable logic implementations.

Key Features

• Core Logic  Approximately 24,576 logic elements and roughly 1,000,000 gates provide the configurable resources for custom digital implementations.
• On‑Chip Memory  Approximately 147,456 bits of embedded RAM to support data buffering, state storage and local memory requirements.
• I/O Density  154 user I/O pins suitable for interfacing with multiple peripherals and external devices.
• Power Supply  Defined core supply voltage range of 1.425 V to 1.575 V for predictable power planning.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for board-level integration.
• Operating Range  Commercial operating temperature specification from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant construction to meet common regulatory and manufacturing requirements.

Typical Applications

• Custom digital logic implementations — Suited for designs that require up to approximately 24,576 logic elements and about 147,456 bits of embedded RAM for control, signal processing or state machines.
• I/O‑intensive interfaces — Use where up to 154 I/O signals are needed to connect sensors, peripherals or parallel interfaces.
• Board-level integration — The 208-BFQFP surface-mount package fits compact PCB layouts while providing a high pin count for system-level connections.
• Commercial electronic products — Targeted for systems operating within the 0 °C to 85 °C commercial temperature range and a defined core supply voltage.

Unique Advantages

• Balanced logic and memory capacity: The combination of ~24,576 logic elements and ~147,456 bits of RAM supports medium-complexity designs without external memory for many use cases.
• High I/O in a compact package: 154 I/Os in a 208-BFQFP package enables dense connectivity while retaining a manageable PCB footprint.
• Predictable power envelope: A defined supply range (1.425 V–1.575 V) simplifies power-supply design and verification.
• Commercial temperature suitability: Specified 0 °C–85 °C operation aligns with standard commercial product requirements.
• RoHS compliance: Meets common environmental and manufacturing requirements for modern electronics production.

Why Choose A3P1000-1PQ208?

The A3P1000-1PQ208 offers a practical balance of logic density, embedded memory and I/O capability in a surface-mount 208-BFQFP package for commercial electronic designs. Its clear electrical and thermal specifications make it straightforward to plan for power, thermal and interface requirements.

Manufactured by Microchip Technology and documented within the ProASIC3 family resources, this device is suitable for engineers and procurement teams seeking a commercially graded programmable logic solution with measurable, verifiable specifications.

Request a quote or submit a procurement inquiry for the A3P1000-1PQ208 to obtain pricing and availability details.