A3P1000-1FGG484M

The A3P1000-1FGG484M is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for military-grade, surface-mount applications. It provides a mix of logic capacity, on-chip memory and I/O density in a 484-ball BGA package, suited to designs that require MIL‑STD‑883 qualification and extended temperature operation.

Key Features

• Logic Capacity  24,576 logic elements (reported as logic element cells) with a gate equivalence of 1,000,000 gates for medium-density programmable logic integration.
• On-Chip Memory  147,456 bits of embedded RAM (approximately 0.147 Mbits) for localized data buffering and state storage.
• I/O Resources  300 user I/Os to support a wide array of external interfaces and parallel connectivity options.
• Package & Mounting  484-ball FBGA (484-FPBGA, 23×23) package in a 484-BGA footprint, designed for surface-mount PCB assembly.
• Power  Core voltage supply range of 1.425 V to 1.575 V, suitable for systems that require tightly controlled FPGA core voltages.
• Temperature & Qualification  Rated for operation from −55 °C to 125 °C and qualified to MIL‑STD‑883, indicating suitability for military-grade thermal and reliability environments.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.

Typical Applications

• Military and Defense Systems  Use in mission-critical signal processing, protocol handling and control functions where MIL‑STD‑883 qualification and extended temperature range are required.
• High-Reliability Embedded Controls  Deployment in rugged embedded control platforms that demand a balance of logic density, on-chip memory and substantial I/O count.
• Aerospace Electronics  Integration into avionics and airborne electronics that require military-grade qualification and operation across wide temperature extremes.

Unique Advantages

• Military-Grade Qualification:  MIL‑STD‑883 qualification and a Grade of "Military" provide clear traceability for defense and high-reliability programs.
• Substantial Logic Resource:  24,576 logic elements and 1,000,000 gates support complex logic designs without resorting to larger, more expensive devices.
• Significant I/O Density:  300 I/Os enable wide peripheral and bus connectivity, reducing the need for external interface components.
• Compact BGA Package:  484-FPBGA (23×23) package delivers high pin-count in a compact surface-mount form factor for space-constrained PCBs.
• Extended Temperature Range:  −55 °C to 125 °C rating supports deployment in extreme environments where thermal resilience is required.
• RoHS Compliant:  Conforms to lead-free assembly requirements for compliant manufacturing processes.

Why Choose A3P1000-1FGG484M?

The A3P1000-1FGG484M delivers a balanced combination of programmable logic capacity, on-chip memory and high I/O count in a military-qualified FPGA package. Its MIL‑STD‑883 qualification, extended −55 °C to 125 °C operating range, and RoHS compliance make it appropriate for defense and high-reliability embedded designs that require proven environmental performance.

Manufactured by Microchip Technology and supplied in a 484-FPBGA (23×23) surface-mount package, this device is suited to designers seeking a compact, rugged FPGA option with clearly defined electrical and thermal specifications.

Request a quote or submit an inquiry to receive pricing and availability for the A3P1000-1FGG484M and to discuss how it fits your project requirements.