A3P1000-1FGG484

The A3P1000-1FGG484 is a ProASIC3 field-programmable gate array from Microchip Technology, delivered in a 484-ball FBGA (23 × 23 mm) surface-mount package. It provides a mid-range logic density and I/O capacity suitable for commercial electronic designs.

Key on-chip resources include 24,576 logic elements, approximately 0.147 Mbits of embedded memory (147,456 total RAM bits), support for up to 300 I/O pins, and an estimated 1,000,000 gates. The device operates from a single supply in the 1.425 V to 1.575 V range and is specified for commercial temperature operation (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Core Logic  Provides 24,576 logic elements to implement medium-complexity digital functions and custom logic.
• Embedded Memory  Includes 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, small data stores, and state machines.
• I/O Capacity  Up to 300 programmable I/O pins support a variety of interfacing requirements in a single device.
• Gate Count  Approximately 1,000,000 gates to represent overall device complexity and integration capability.
• Power Supply  Single supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting  Supplied in a 484-FPBGA (23 × 23 mm) surface-mount package for compact board-level integration.
• Operating Range & Grade  Commercial temperature rating from 0 °C to 85 °C and RoHS compliance for environmental standards.

Typical Applications

• Custom Digital Logic  Implement glue logic, protocol adapters, and application-specific processing where ~24,576 logic elements and 300 I/O are required.
• Interface and I/O Extension  Consolidate multiple serial and parallel interfaces into a single FPGA for systems needing moderate I/O density.
• Embedded Control and State Machines  Use on-chip RAM and logic elements to implement control pipelines, sequencing, and finite-state control for commercial products.

Unique Advantages

• Balanced Logic Density: 24,576 logic elements deliver a balance of capacity and efficiency for medium-complexity designs without overspecifying resources.
• Significant I/O Count: Up to 300 I/O pins enable consolidation of multiple signals and interfaces onto a single device, reducing board-level wiring and connectors.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM supports buffering, small FIFOs, and lookup tables directly within the FPGA fabric.
• Compact Package: The 484-FPBGA (23 × 23 mm) surface-mount package provides a high-density footprint for space-constrained PCB layouts.
• Single-Supply Core: Narrow core voltage range (1.425 V–1.575 V) simplifies power-rail planning for the FPGA core.
• Compliance and Commercial Grade: RoHS compliance and a commercial temperature range support mainstream electronic product development and manufacturing.

Why Choose A3P1000-1FGG484?

The A3P1000-1FGG484 positions itself as a commercially graded ProASIC3 FPGA that balances logic capacity, I/O availability, and on-chip memory for a broad set of commercial applications. Its 24,576 logic elements, 300 I/O pins, and compact 484-FPBGA package make it suitable for designs that require moderate integration without moving to larger, more complex devices.

Designed for teams targeting commercial products, this Microchip FPGA offers predictable electrical requirements with a defined core voltage range, RoHS compliance, and a standard 0 °C to 85 °C operating window—helping accelerate development while maintaining straightforward board-level integration.

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