A3P1000-1FGG256I

The A3P1000-1FGG256I is a ProASIC3 Field Programmable Gate Array (FPGA) in a 256-ball BGA package designed for industrial applications. It provides up to 1,000,000 gates, 24,576 logic elements and 177 user I/Os to support complex digital designs that require significant logic capacity and flexible I/O count.

This device operates from a 1.425 V to 1.575 V supply and is specified for an operating temperature range of -40 °C to 100 °C, making it suitable for temperature-demanding, surface-mount applications where robustness and integration are required.

Key Features

• Core Capacity  Approximately 1,000,000 gates and 24,576 logic elements provide substantial resources for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.14 Mbits of on-chip RAM (147,456 total bits) to support buffering, state storage and local data processing.
• I/O Density  177 user I/Os to accommodate multiple external interfaces, sensors, and peripheral connections in compact designs.
• Package & Mounting  256-ball LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount assembly and high-density board layouts.
• Power  Single supply operation within a defined range of 1.425 V to 1.575 V for predictable power integration.
• Temperature Range & Grade  Industrial-grade device rated for -40 °C to 100 °C operation to meet harsher environment requirements.
• Compliance  RoHS-compliant, supporting environmental and material requirements for modern electronics manufacturing.

Typical Applications

• Industrial Control  Use where an industrial temperature range and significant I/O count are required for control, timing, and interfacing tasks.
• Embedded Systems  Suitable for embedded designs demanding up to 24,576 logic elements and on-chip memory for local processing and customization.
• Communications and Networking  Applicable to systems that need substantial gate density and multiple I/Os for protocol handling and data routing.

Unique Advantages

• High Logic Density:  1,000,000 gates and 24,576 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• On-Device Memory:  Approximately 0.14 Mbits of embedded RAM supports buffering and local data storage, minimizing external memory needs.
• Extensive I/O:  177 user I/Os provide flexibility for interfacing with sensors, peripherals, and high-pin-count connectors without multiple devices.
• Industrial Temperature Capability:  Rated from -40 °C to 100 °C to maintain operation in demanding temperature environments.
• Compact, Surface-Mount Package:  256-LBGA (256-FPBGA, 17×17) supports high-density PCB designs and automated assembly processes.
• Regulatory Compliance:  RoHS-compliant construction helps meet environmental material requirements in production.

Why Choose A3P1000-1FGG256I?

The A3P1000-1FGG256I positions itself as a robust, industrial-grade FPGA option for designs that require substantial logic resources, embedded memory, and a high number of I/Os in a compact surface-mount package. Its defined supply voltage range and extended operating temperature rating make it a practical choice for temperature-challenging and space-constrained applications.

Designers seeking to consolidate functions, reduce bill-of-materials, and maintain operation across a wide temperature range will find the device’s combination of gates, logic elements, I/O density, and package options aligned with those goals.

Request a quote or submit an inquiry to obtain pricing, availability and support for the A3P1000-1FGG256I for your next design.