A3P1000-1FGG144T
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA |
|---|---|
| Quantity | 843 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 147456 |
Overview of A3P1000-1FGG144T – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA
The A3P1000-1FGG144T is a ProASIC3 family FPGA from Microchip Technology, delivered in a 144-LBGA surface-mount package. It provides a mix of programmable logic, I/O capacity and on-chip memory tailored for designs requiring a compact, automotive-qualified programmable device.
Key device attributes include 24,576 logic elements, approximately 0.147 Mbits of embedded memory, 97 I/Os and an internal gate count of 1,000,000, all specified for operation across a supply range of 1.425 V to 1.575 V and a temperature range of -40 °C to 125 °C.
Key Features
- Core Logic 24,576 logic elements provide flexible programmable resources suitable for custom logic, glue-logic and control functions.
- Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage and small lookup tables.
- I/O and Logic Density 97 general-purpose I/Os and an internal gate count of 1,000,000 enable moderate I/O connectivity with substantial logic capacity.
- Power and Voltage Designed for operation from 1.425 V to 1.575 V supply rails to meet tight system power requirements.
- Package and Mounting Available in a 144-LBGA (supplier package: 144-FPBGA 13×13) surface-mount package for compact PCB integration.
- Automotive Qualification Automotive grade with AEC-Q100 qualification and an operating temperature range of -40 °C to 125 °C for demanding environments.
- Compliance RoHS-compliant construction aligns with environmental and regulatory requirements.
Typical Applications
- Automotive electronics — Suitable for vehicle systems that require AEC-Q100 qualification and extended temperature range, such as control and interface functions.
- Embedded control and signal processing — Programmable logic and on-chip RAM support custom control algorithms and small-data buffering tasks.
- Custom I/O bridging — High I/O count enables protocol conversion, signal conditioning, and interface adaptation in compact systems.
Unique Advantages
- Automotive-qualified design: AEC-Q100 qualification and a -40 °C to 125 °C operating range support deployment in temperature-stressed vehicle environments.
- Compact package: 144-LBGA (144-FPBGA 13×13) surface-mount package reduces PCB footprint while providing robust I/O density.
- Balanced logic and memory: 24,576 logic elements combined with approximately 0.147 Mbits of on-chip RAM deliver a practical balance for control and interfacing tasks.
- Deterministic supply range: Narrow supply window (1.425 V–1.575 V) simplifies power design and integration into regulated systems.
- Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.
Why Choose A3P1000-1FGG144T?
The A3P1000-1FGG144T positions itself as a compact, automotive-qualified FPGA option that combines moderate logic density, on-chip memory and a substantial I/O count in a small LBGA package. Its AEC-Q100 qualification and extended temperature rating make it suitable for vehicle-level applications where component qualification and thermal robustness are required.
Designers building embedded control, interface, and custom logic functions will find the device useful for space-constrained boards that demand clear supply requirements and predictable thermal performance, while RoHS compliance aligns with modern manufacturing practices.
Request a quote or submit an inquiry for the A3P1000-1FGG144T to receive pricing, availability and lead-time details for your project needs.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D