A3P1000-1FGG144T

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 843 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits147456

Overview of A3P1000-1FGG144T – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

The A3P1000-1FGG144T is a ProASIC3 family FPGA from Microchip Technology, delivered in a 144-LBGA surface-mount package. It provides a mix of programmable logic, I/O capacity and on-chip memory tailored for designs requiring a compact, automotive-qualified programmable device.

Key device attributes include 24,576 logic elements, approximately 0.147 Mbits of embedded memory, 97 I/Os and an internal gate count of 1,000,000, all specified for operation across a supply range of 1.425 V to 1.575 V and a temperature range of -40 °C to 125 °C.

Key Features

  • Core Logic 24,576 logic elements provide flexible programmable resources suitable for custom logic, glue-logic and control functions.
  • Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage and small lookup tables.
  • I/O and Logic Density 97 general-purpose I/Os and an internal gate count of 1,000,000 enable moderate I/O connectivity with substantial logic capacity.
  • Power and Voltage Designed for operation from 1.425 V to 1.575 V supply rails to meet tight system power requirements.
  • Package and Mounting Available in a 144-LBGA (supplier package: 144-FPBGA 13×13) surface-mount package for compact PCB integration.
  • Automotive Qualification Automotive grade with AEC-Q100 qualification and an operating temperature range of -40 °C to 125 °C for demanding environments.
  • Compliance RoHS-compliant construction aligns with environmental and regulatory requirements.

Typical Applications

  • Automotive electronics — Suitable for vehicle systems that require AEC-Q100 qualification and extended temperature range, such as control and interface functions.
  • Embedded control and signal processing — Programmable logic and on-chip RAM support custom control algorithms and small-data buffering tasks.
  • Custom I/O bridging — High I/O count enables protocol conversion, signal conditioning, and interface adaptation in compact systems.

Unique Advantages

  • Automotive-qualified design: AEC-Q100 qualification and a -40 °C to 125 °C operating range support deployment in temperature-stressed vehicle environments.
  • Compact package: 144-LBGA (144-FPBGA 13×13) surface-mount package reduces PCB footprint while providing robust I/O density.
  • Balanced logic and memory: 24,576 logic elements combined with approximately 0.147 Mbits of on-chip RAM deliver a practical balance for control and interfacing tasks.
  • Deterministic supply range: Narrow supply window (1.425 V–1.575 V) simplifies power design and integration into regulated systems.
  • Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose A3P1000-1FGG144T?

The A3P1000-1FGG144T positions itself as a compact, automotive-qualified FPGA option that combines moderate logic density, on-chip memory and a substantial I/O count in a small LBGA package. Its AEC-Q100 qualification and extended temperature rating make it suitable for vehicle-level applications where component qualification and thermal robustness are required.

Designers building embedded control, interface, and custom logic functions will find the device useful for space-constrained boards that demand clear supply requirements and predictable thermal performance, while RoHS compliance aligns with modern manufacturing practices.

Request a quote or submit an inquiry for the A3P1000-1FGG144T to receive pricing, availability and lead-time details for your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up