A3P1000-1FGG256

The A3P1000-1FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC offering 1,000,000 gates and 24,576 logic elements for commercial designs. It provides on-chip embedded memory, 177 user I/O signals, and a compact 256-LBGA package for surface-mount system implementation.

Engineered for commercial applications that require high logic capacity and significant I/O count, this device operates within a 1.425 V to 1.575 V supply range and across a 0 °C to 85 °C temperature window, while complying with RoHS requirements.

Key Features

• Core Capacity 1,000,000 gates and 24,576 logic elements provide substantial programmable logic resources for complex glue logic, custom datapaths, and control logic implementations.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) available for buffering, state storage, and small lookup tables.
• I/O Resources Up to 177 user I/O pins to support dense signal interfacing and multiple parallel interfaces.
• Power and Voltage Operates from a 1.425 V to 1.575 V supply, enabling integration into systems with tight core-voltage requirements.
• Package and Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Operating Range and Grade Commercial-grade device specified for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• I/O-Intensive Control Use the device's 177 I/Os to implement sensor interfacing, actuator control, and real-time I/O aggregation in commercial systems.
• Custom Logic and Glue-Logic Deploy the 1,000,000 gates and 24,576 logic elements for protocol bridging, timing adaptation, and bespoke logic functions on a single device.
• Compact, High-Density Designs The 256-LBGA surface-mount package supports space-constrained PCBs while retaining high logic and I/O counts.

Unique Advantages

• High Logic Density: A large gate count and extensive logic elements reduce the need for multiple discrete devices, simplifying system design.
• Integrated Memory: On-chip RAM (approximately 0.147 Mbits) supports local buffering and state machines without external memory components.
• Substantial I/O Count: 177 user I/Os enable direct interfacing to sensors, peripherals, and parallel bus structures, minimizing external routing complexity.
• Compact Package: 256-LBGA (256-FPBGA, 17×17) surface-mount packaging enables dense board layouts and reliable soldered connections.
• Commercial Temperature Range: Specified operation from 0 °C to 85 °C aligns with a wide range of commercial electronic products.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose A3P1000-1FGG256?

The A3P1000-1FGG256 combines substantial programmable logic (1,000,000 gates and 24,576 logic elements) with a high I/O count and embedded memory to address demanding commercial designs that require integration, flexibility, and compact packaging. Its 256-LBGA surface-mount package and defined supply and temperature ranges make it a practical choice for engineers building space-efficient, I/O-rich systems.

This device is well suited for development teams and OEMs seeking a programmable solution that consolidates logic, memory, and I/O on a single commercial-grade FPGA, offering a clear path to reduce board complexity and component count while maintaining verifiable electrical and thermal parameters.

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