A3P1000-1FGG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 905 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of A3P1000-1FGG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 I/Os, 147,456 RAM bits, 144-LBGA

The A3P1000-1FGG144I is a ProASIC3 FPGA offering reprogrammable logic tailored for industrial applications. It integrates approximately 24,576 logic elements and 147,456 bits of on-chip RAM to support a wide range of control, interface and signal-processing tasks.

Built for surface-mount deployment in a 144-LBGA (13×13) package, this device provides a 97-pin I/O complement, a supply operating range of 1.425 V to 1.575 V, and an industrial operating temperature window from -40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 24,576 logic elements (cells) enabling up to 1,000,000 gates of user logic capacity for custom digital designs.
  • Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support buffering, state machines and small data structures without external memory.
  • I/O Capability  97 general-purpose I/Os to interface with sensors, peripherals and external logic devices.
  • Power  Core supply range from 1.425 V to 1.575 V to match target system rails and enable stable logic operation.
  • Package and Mounting  144-LBGA (13×13) supplier device package in a surface-mount format for compact board layouts and reliable soldering.
  • Temperature and Grade  Industrial-grade specification with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS-compliant manufacturing for regulatory and sustainability considerations.

Typical Applications

  • Industrial Control  Implement custom motor control, PLC logic and timing functions using on-chip logic and RAM for deterministic behavior in industrial environments.
  • Communication Interfaces  Bridge and translate between digital interfaces or implement protocol-handling logic using available I/O and embedded memory.
  • Embedded Signal Processing  Perform small-scale signal handling, pre-processing or data aggregation close to sensors and front-end electronics.

Unique Advantages

  • Reconfigurable Hardware: FPGA-based logic lets designers iterate and update system functionality without changing ASICs or discrete logic.
  • Balanced Logic and Memory: The combination of ~24,576 logic elements and 147,456 bits of embedded RAM supports both control and modest data buffering on-chip.
  • Industrial Temperature Range: Rated for -40 °C to 100 °C operation, making it suitable for deployment in harsh or variable-temperature installations.
  • Compact, Surface-Mount Package: 144-LBGA footprint enables high-density PCB layouts while maintaining a robust interconnect for production assembly.
  • Defined Power Envelope: 1.425 V to 1.575 V supply specification supports integration with low-voltage system rails.
  • Regulatory Conformity: RoHS-compliant to meet common environmental directives for electronic assemblies.

Why Choose A3P1000-1FGG144I?

The A3P1000-1FGG144I positions itself as a pragmatic FPGA choice for industrial applications that require reconfigurable logic, a moderate element count, and on-chip memory. Its combination of approximately 24,576 logic elements, 147,456 bits of embedded RAM, and 97 I/Os provides a flexible platform for control, interfacing and modest signal-processing tasks.

Engineers designing systems for industrial environments benefit from the device’s extended temperature range, surface-mount 144-LBGA package for compact boards, and defined core supply window. The A3P1000-1FGG144I is suited to teams that need a reliable, updatable hardware building block with clear, verifiable specifications.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the A3P1000-1FGG144I.

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