A3P1000-1FGG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA |
|---|---|
| Quantity | 905 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of A3P1000-1FGG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 I/Os, 147,456 RAM bits, 144-LBGA
The A3P1000-1FGG144I is a ProASIC3 FPGA offering reprogrammable logic tailored for industrial applications. It integrates approximately 24,576 logic elements and 147,456 bits of on-chip RAM to support a wide range of control, interface and signal-processing tasks.
Built for surface-mount deployment in a 144-LBGA (13×13) package, this device provides a 97-pin I/O complement, a supply operating range of 1.425 V to 1.575 V, and an industrial operating temperature window from -40 °C to 100 °C.
Key Features
- Core Logic Approximately 24,576 logic elements (cells) enabling up to 1,000,000 gates of user logic capacity for custom digital designs.
- Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support buffering, state machines and small data structures without external memory.
- I/O Capability 97 general-purpose I/Os to interface with sensors, peripherals and external logic devices.
- Power Core supply range from 1.425 V to 1.575 V to match target system rails and enable stable logic operation.
- Package and Mounting 144-LBGA (13×13) supplier device package in a surface-mount format for compact board layouts and reliable soldering.
- Temperature and Grade Industrial-grade specification with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS-compliant manufacturing for regulatory and sustainability considerations.
Typical Applications
- Industrial Control Implement custom motor control, PLC logic and timing functions using on-chip logic and RAM for deterministic behavior in industrial environments.
- Communication Interfaces Bridge and translate between digital interfaces or implement protocol-handling logic using available I/O and embedded memory.
- Embedded Signal Processing Perform small-scale signal handling, pre-processing or data aggregation close to sensors and front-end electronics.
Unique Advantages
- Reconfigurable Hardware: FPGA-based logic lets designers iterate and update system functionality without changing ASICs or discrete logic.
- Balanced Logic and Memory: The combination of ~24,576 logic elements and 147,456 bits of embedded RAM supports both control and modest data buffering on-chip.
- Industrial Temperature Range: Rated for -40 °C to 100 °C operation, making it suitable for deployment in harsh or variable-temperature installations.
- Compact, Surface-Mount Package: 144-LBGA footprint enables high-density PCB layouts while maintaining a robust interconnect for production assembly.
- Defined Power Envelope: 1.425 V to 1.575 V supply specification supports integration with low-voltage system rails.
- Regulatory Conformity: RoHS-compliant to meet common environmental directives for electronic assemblies.
Why Choose A3P1000-1FGG144I?
The A3P1000-1FGG144I positions itself as a pragmatic FPGA choice for industrial applications that require reconfigurable logic, a moderate element count, and on-chip memory. Its combination of approximately 24,576 logic elements, 147,456 bits of embedded RAM, and 97 I/Os provides a flexible platform for control, interfacing and modest signal-processing tasks.
Engineers designing systems for industrial environments benefit from the device’s extended temperature range, surface-mount 144-LBGA package for compact boards, and defined core supply window. The A3P1000-1FGG144I is suited to teams that need a reliable, updatable hardware building block with clear, verifiable specifications.
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Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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