A3P1000-1FG484I

The A3P1000-1FG484I is a ProASIC3 field programmable gate array (FPGA) delivered in a 484-ball BGA package. It provides 24,576 logic elements, approximately 147,456 bits of embedded memory, and up to 300 I/O for compact, medium-density programmable logic designs.

Designed for industrial environments, this device operates over a –40 °C to 100 °C range and runs from a 1.425 V to 1.575 V supply, making it suitable for designs that require broad temperature tolerance, substantial on-chip logic and memory, and a high I/O count.

Key Features

• Logic Capacity  24,576 logic elements (cells) supporting up to 1,000,000 gates for medium-density programmable logic implementations.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.147 Mbits) for local data buffering and state storage.
• I/O and Integration  Up to 300 general-purpose I/O pins to support complex interfacing and multi-signal systems.
• Package and Mounting  484-ball FPBGA package (23 × 23 mm) with surface-mount mounting type for compact board integration.
• Power  Single supply range of 1.425 V to 1.575 V for core operation.
• Operating Range  Industrial-grade operating temperature from –40 °C to 100 °C for deployments in demanding ambient conditions.
• Compliance  RoHS compliant.

Typical Applications

• Custom programmable logic  Implement application-specific state machines, data-paths, and control logic within the device's 24,576 logic elements and on-chip RAM.
• I/O-dense interfacing  Use the 300 I/O pins to aggregate and manage multiple sensors, buses, or peripheral interfaces on a single device.
• Industrial control and monitoring  Deploy in systems that benefit from the device's industrial temperature range (–40 °C to 100 °C) and robust logic capacity.

Unique Advantages

• Substantial logic resources: 24,576 logic elements and 1,000,000 gates enable sizable custom logic without external ASICs or multiple FPGAs.
• On-chip memory: 147,456 bits of embedded RAM reduce external memory dependencies for buffering and state retention.
• High I/O count: 300 I/O pins simplify board-level routing for complex interfacing requirements.
• Industrial temperature rating: Rated from –40 °C to 100 °C for use in temperature-challenging environments.
• Compact BGA footprint: 484-FPBGA (23×23) package supports dense, surface-mount board designs.
• Regulatory compliance: RoHS compliant to support environmental and manufacturing requirements.

Why Choose A3P1000-1FG484I?

The A3P1000-1FG484I positions itself as a reliable, mid-capacity FPGA option that combines significant logic resources, on-chip memory, and a high I/O count in a compact BGA package. Its industrial operating range and RoHS compliance make it suitable for designs that demand temperature resilience and environmental compliance.

This device is well suited for engineering teams building custom programmable logic solutions that require a balance of logic density, embedded memory, and extensive I/O while maintaining a small board footprint and consistent operating characteristics.

Request a quote today to check pricing and availability for the A3P1000-1FG484I and to discuss quantity lead times or technical fit for your design needs.