A3P1000-1FG256M

The A3P1000-1FG256M is a ProASIC3 Field Programmable Gate Array (FPGA) offering a balance of logic density, I/O count and rugged qualification for demanding applications. It provides 1,000,000 gates and 24,576 logic elements in a compact 256-LBGA package, with on-chip embedded memory and a wide operating temperature range.

Designed for applications requiring military-grade qualification and wide temperature operation, this device suits systems where reliability, reprogrammability and compact board-level integration are key design drivers.

Key Features

• Core Logic  24,576 logic elements delivering a total of 1,000,000 gates for implementing complex digital functions and control logic.
• Embedded Memory  Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, state machines and small data storage.
• I/O Capacity  177 I/O pins to support extensive peripheral interfacing and multi-signal system integration.
• Power Supply  Low-voltage operation with supply range from 1.14 V to 1.575 V for designs targeting reduced core power and compatibility with modern low-voltage domains.
• Package  256-LBGA package (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for dense PCB integration.
• Temperature & Qualification  Qualified to MIL-STD-883 and rated for operation from -55°C to 125°C, meeting requirements for military-grade deployments.
• Regulatory  RoHS compliant.

Typical Applications

• Military & Aerospace Systems  Use where MIL-STD-883 qualification and a -55°C to 125°C operating range are required for rugged, high-reliability designs.
• Embedded Control  Implement control logic, state machines and interface glue logic using the device's 24,576 logic elements and extensive I/O.
• Communications Equipment  Support protocol handling, data buffering and I/O aggregation with its on-chip RAM and high pin count.

Unique Advantages

• Military-Grade Qualification:  MIL-STD-883 qualification provides traceable assurance for defense and aerospace applications.
• Wide Temperature Range:  Operation from -55°C to 125°C supports deployments across extreme environments without additional qualification.
• High Logic Density:  24,576 logic elements and 1,000,000 gates enable implementation of sizable digital designs within a single FPGA.
• Ample I/O Count:  177 I/O pins reduce the need for external multiplexing and simplify board-level connectivity.
• Compact Package:  256-LBGA (17×17 FPBGA) surface-mount package balances board space efficiency with thermal and signal routing considerations.
• Low-Voltage Core:  1.14 V to 1.575 V supply range supports integration with modern low-voltage system domains.

Why Choose A3P1000-1FG256M?

The A3P1000-1FG256M positions itself as a reliable, qualified FPGA option for applications where military-level qualification, wide temperature operation and substantial logic resources are required. Its combination of 1,000,000 gates, 24,576 logic elements, 177 I/Os and on-chip memory provides designers with the capacity to consolidate functions while maintaining board-level compactness.

This device is well suited for engineers developing defense, aerospace and other high-reliability embedded systems who need a reprogrammable solution with proven qualification and defined electrical and thermal limits.

Request a quote or submit a pricing and availability inquiry to obtain lead times and ordering information for the A3P1000-1FG256M.