A3P1000-1FG144T

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 109 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits147456

Overview of A3P1000-1FG144T – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 I/Os, 147,456-bit RAM, 144-LBGA

The A3P1000-1FG144T is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) offered in a 144-LBGA package. It provides a combination of logic capacity, embedded RAM, and a defined I/O count suited for designs that require non-volatile programmable logic within a compact surface-mount package.

Designed with explicit electrical and environmental ranges, this device targets applications that need up to 1,000,000 gates, 24,576 logic elements, and robust operation across a wide temperature span.

Key Features

  • Logic Capacity  Provides 24,576 logic elements (cells) and an internal gate count of 1,000,000 to support complex combinational and sequential logic implementations.
  • Embedded Memory  Includes 147,456 bits of on-chip RAM for local buffering, state storage, and small embedded data structures.
  • I/O Count  Offers 97 general-purpose I/Os to interface with peripherals, sensors, and external logic devices.
  • Package & Mounting  Delivered in a 144-LBGA (supplier package: 144-FPBGA 13×13) surface-mount package for compact board layouts.
  • Power  Specified supply voltage range of 1.425 V to 1.575 V to meet defined core-power requirements.
  • Temperature Range  Rated for operation from −40 °C to 125 °C for extended-temperature applications.
  • Automotive Qualification  Automotive grade with AEC-Q100 qualification, suitable where that qualification is required.
  • Environmental Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

  • Automotive control modules  AEC-Q100 qualification and −40 °C to 125 °C operation allow deployment in automotive electronic control units that require qualified programmable logic.
  • Logic consolidation  Use where a single FPGA must implement complex logic functions—up to 1,000,000 gates and 24,576 logic elements reduce the need for multiple discrete devices.
  • Embedded buffering and state storage  147,456 bits of on-chip RAM support local data buffering and small embedded memories without external RAM.
  • Moderate I/O control  The 97 I/Os suit applications that require multiple peripheral interfaces or sensor connections within a compact package.

Unique Advantages

  • High logic density:  24,576 logic elements and 1,000,000 gates enable implementation of sizable digital functions in a single device, reducing board-level component count.
  • Qualified for automotive environments:  AEC-Q100 qualification and extended temperature rating provide assurance for designs that require automotive-grade components.
  • Compact surface-mount package:  144-LBGA (13×13) format supports low-profile, space-constrained PCB designs while providing significant I/O and logic capacity.
  • Defined power envelope:  A narrow supply voltage range (1.425 V–1.575 V) supports predictable power design and margining in regulated systems.
  • On-chip memory for local processing:  147,456 bits of embedded RAM reduce reliance on external memory for small buffers and state machines.
  • RoHS compliance:  Manufactured to meet RoHS requirements for environmental and regulatory needs.

Why Choose A3P1000-1FG144T?

The A3P1000-1FG144T positions itself as a robust, automotive-qualified programmable logic device delivering significant logic capacity, built-in RAM, and a moderate I/O count in a compact 144-LBGA package. Its defined supply and extended operating temperature range make it suitable for designs that need predictable electrical and thermal performance over long lifecycles.

This device is well suited to engineers seeking to consolidate logic, implement embedded buffering, or deploy programmable logic in temperature- and qualification-sensitive systems while maintaining a compact board footprint.

Request a quote or submit an inquiry for pricing and availability to evaluate the A3P1000-1FG144T for your next design project.

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