A3P1000-1FG144

The A3P1000-1FG144 is a ProASIC3 family Field Programmable Gate Array (FPGA) from Microchip Technology. It provides on-chip programmable logic and I/O resources in a compact 144-FPBGA (13×13) surface-mount package for commercial electronic designs.

With 24,576 logic elements, approximately 0.144 Mbits of embedded memory and 97 user I/Os, this device is suited to custom digital logic implementations, interface bridging and general-purpose programmable logic tasks in commercial systems.

Key Features

• Logic Capacity  24,576 logic elements to implement custom combinational and sequential logic.
• Embedded Memory  Approximately 0.144 Mbits of on-chip RAM (144,000 bits) for data buffering, small lookup tables and state storage.
• I/O Resources  97 user I/O pins to support multiple peripherals, interfaces and signal connections.
• Gate Count  Approximately 1,000,000 gates for overall design density and integration.
• Power  Single nominal supply of 1.425 V for core operation.
• Package and Mounting  144-FPBGA (13×13) supplier device package in a surface-mount form factor; supplied in tray packaging.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Implement custom digital logic and control functions where a compact, surface-mount FPGA is required.
• Interface and Protocol Bridging  Use the device’s I/O resources to adapt or bridge between different digital interfaces in product-level designs.
• Prototyping and Development  Suitable for designers evaluating programmable logic implementations for commercial products.

Unique Advantages

• Substantial Logic Density:  24,576 logic elements enable integration of sizeable custom logic without external components.
• On‑Chip Memory:  Approximately 0.144 Mbits of embedded RAM reduces the need for small external memory devices for buffering and state storage.
• Ample I/O Count:  97 I/Os provide flexible connectivity for multiple peripherals and signal domains.
• Compact, Surface‑Mount Package:  144-FPBGA (13×13) allows high-density board designs while maintaining a tray packaging option for production handling.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C for deployment in commercial electronics and consumer applications.
• Regulatory Compliance:  RoHS compliant for environmentally conscious design and global supply chain acceptance.

Why Choose A3P1000-1FG144?

The A3P1000-1FG144 positions a balanced combination of logic density, on-chip memory and I/O capability in a compact BGA package for commercial electronic designs. Its 24,576 logic elements, approximately 0.144 Mbits of embedded RAM and 97 I/Os make it suitable for projects that require moderate programmable logic integration without external complexity.

This device is well suited to engineers and procurement teams targeting commercial embedded systems, interface adaptation and prototype-to-production workflows, offering a straightforward specification set and RoHS compliance for streamlined deployment.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for the A3P1000-1FG144.