A3P1000-1FG256

The A3P1000-1FG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade embedded applications. It provides reprogrammable logic with a defined gate count, logic element capacity, on-chip RAM and a substantial complement of I/O in a compact 256-LBGA package.

This device is aimed at designs that require deterministic, on-board programmable logic and I/O density while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic 1,000,000 gates and 24,576 logic elements provide defined capacity for implementing combinational and sequential logic functions.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for buffering, small data tables and state storage.
• I/O Density 177 user I/O pins to support multiple peripheral interfaces and board-level signal routing.
• Power Supply Operates from a supply range of 1.425 V to 1.575 V to match targeted system power rails.
• Package and Mounting 256-LBGA package (supplier package 256-FPBGA, 17×17) with surface-mount mounting for compact PCB implementations.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C for typical commercial electronics environments.
• Environmental Compliance RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• Embedded Control Implement custom logic, state machines and control functions where on-board programmability is required.
• Interface Bridging Provide glue logic and protocol adaptation between controllers, peripherals and sensors using available I/O.
• Prototyping and Development Evaluate and iterate FPGA-based designs that fit within the device’s gate count and logic element capacity.
• Commercial Electronics Integrate into consumer or commercial devices that operate within the specified temperature and voltage ranges.

Unique Advantages

• Defined Logic Capacity: 24,576 logic elements and 1,000,000 gates allow predictable resource budgeting for design implementation.
• Embedded Memory on Chip: Approximately 0.15 Mbits of RAM reduces dependence on external memory for small buffers and tables.
• Substantial I/O Count: 177 I/O pins simplify board routing and enable multiple peripheral connections without external multiplexing.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) supports high-density PCB layouts while keeping a small footprint.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical commercial electronic product requirements.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose A3P1000-1FG256?

The A3P1000-1FG256 positions itself as a commercially graded, reprogrammable logic device that balances logic capacity, on-chip memory and I/O density in a compact 256-LBGA package. Its defined gate count, 24,576 logic elements and approximately 0.15 Mbits of embedded RAM give engineers concrete resource limits for predictable implementation.

This FPGA is well suited for developers and procurement teams building commercial embedded systems, interface logic and prototype platforms where a clear specification of gates, logic elements, I/O and operating conditions simplifies design trade-offs and BOM decisions.

Request a quote or submit a procurement inquiry to obtain pricing, lead-time and availability for the A3P1000-1FG256.