A3P1000-1FG256T

The A3P1000-1FG256T is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for demanding embedded applications. It provides a combination of substantial logic capacity, on-chip memory, and high I/O count in a compact 256-LBGA package.

With automotive-grade qualification (AEC-Q100) and a wide operating temperature range, this device is targeted at applications that require robust operation across temperature extremes while maintaining programmable hardware flexibility.

Key Features

• Logic Capacity  24,576 logic elements (cells) delivering approximately 1,000,000 gates of programmable logic.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for data buffering and small lookup tables.
• I/O Density  177 dedicated I/O pins to support interfacing and system integration.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting  256-LBGA package; supplier device package listed as 256-FPBGA (17 × 17). Surface-mount mounting type.
• Automotive Qualification & Temperature  Grade: Automotive with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C.
• Integration Scale  1,000,000 gates and 24,576 logic elements provide a balance of integration and flexibility for mid-density FPGA designs.

Typical Applications

• Automotive systems  AEC-Q100 qualification and −40 °C to 125 °C operation make this FPGA suitable for electronic modules that require automotive-grade components.
• Embedded control and interface  Ample logic elements and 177 I/O support custom control logic, protocol bridging, and interface adaptation within embedded systems.
• Harsh-environment electronics  Automotive-grade qualification and wide temperature range enable deployment in environments where thermal and reliability requirements are stringent.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 qualification and automotive grade classification document suitability for automotive supply chains and requirements.
• High programmable logic density: 24,576 logic elements and approximately 1,000,000 gates provide substantial room for implementing complex logic functions on-chip.
• Compact, high-density package: 256-LBGA (256-FPBGA, 17 × 17) provides a space-efficient footprint with a high I/O count for board-level integration.
• Controlled power window: Defined supply range of 1.425 V to 1.575 V simplifies power-domain planning for system designers.
• Wide operating temperature: −40 °C to 125 °C rating supports deployment across a broad range of environmental conditions.

Why Choose A3P1000-1FG256T?

The A3P1000-1FG256T positions itself as a mid-density FPGA solution that balances logic capacity, embedded memory, and I/O density within a compact automotive-qualified package. Its AEC-Q100 qualification and wide temperature range make it a practical option for designs that must meet automotive or similarly demanding reliability criteria.

This device is well suited to engineers and procurement teams looking for a programmable logic component that integrates significant logic resources (24,576 elements), substantial I/O (177 pins), and verified qualification for use across challenging thermal environments, while fitting into space-constrained board designs.

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