A3P1000-1FG484M

The A3P1000-1FG484M is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for demanding, high-reliability embedded applications. It provides a balanced combination of logic capacity, on-chip memory and I/O density in a 484-ball BGA package with military-grade qualification.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 300 I/O pins, this device is suited to systems that require robust operation across a wide temperature range and formal MIL-STD-883 qualification.

Key Features

• Logic Capacity 24,576 logic elements and 1,000,000 gates to implement complex digital logic and control functions.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state machines and small-data storage close to logic.
• I/O Density 300 user I/O pins to support extensive peripheral connectivity and high-pin-count interfaces.
• Power Supply Narrow operating supply range of 1.425 V to 1.575 V for defined supply requirements in system design.
• Temperature & Qualification Military grade with operating temperature from −55 °C to 125 °C and qualification to MIL-STD-883 for high-reliability environments.
• Package & Mounting 484-BGA package (supplier package: 484-FPBGA, 23×23) with surface-mount assembly compatibility for compact, high-density boards.
• Compliance RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• Military and Defense Systems Use in mission-critical electronics where MIL-STD-883 qualification and wide operating temperature are required.
• Aerospace Electronics On-board signal control, interface logic and subsystem coordination that benefit from high I/O count and robust qualification.
• Embedded Control Systems Complex control logic and state machines for industrial-grade embedded platforms that need substantial logic and local RAM.
• High-Reliability Communications Protocol handling and interface adaptation where logic density and a large number of I/Os enable flexible connectivity.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and a −55 °C to 125 °C operating range provide confidence for high-reliability deployments.
• High Logic Density: 24,576 logic elements and 1,000,000 gates allow implementation of sizeable digital functions on a single device, reducing board-level complexity.
• Ample I/O Resources: 300 I/Os support complex multi-signal interfaces and enable integration of multiple peripherals without external multiplexing.
• Compact BGA Packaging: 484-BGA (484-FPBGA, 23×23) delivers a high-pin-count solution in a small footprint for space-constrained assemblies.
• Predictable Supply Requirements: Defined voltage range (1.425–1.575 V) aids in power-supply planning and system-level stability.
• RoHS Compliant: Meets restricted-substance requirements for regulated manufacturing environments.

Why Choose A3P1000-1FG484M?

The A3P1000-1FG484M positions itself as a rugged, highly capable FPGA option for designs that require significant logic resources, substantial I/O, and formal military qualification. Its combination of 24,576 logic elements, on-chip RAM and 300 I/Os in a 484-BGA package makes it appropriate for defense, aerospace and other high-reliability embedded systems.

Backed by Microchip Technology and specified for MIL-STD-883 operation and wide temperature extremes, this device delivers a predictable, compact platform for long-life and mission-critical applications where durability and integration matter.

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