A3P1000-1FGG144

The A3P1000-1FGG144 is a ProASIC3 field programmable gate array from Microchip Technology, offering a programmable logic solution with 1,000,000 gates and 24,576 logic elements. It provides on-chip embedded memory and a 97-pin I/O count in a 144-FPBGA (13×13) surface-mount package for commercial-temperature designs.

This device is suited to designs that require mid-range programmable logic density, dedicated I/O capacity, and a compact BGA package footprint while operating from a fixed 1.425 V supply and across a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Density 24,576 logic elements and approximately 1,000,000 gates provide substantial programmable resources for mid-range logic implementations.
• Embedded Memory Approximately 0.144 Mbits of on-chip RAM (144,000 bits) to support local buffering and distributed storage within the FPGA fabric.
• I/O Capacity 97 I/Os to accommodate multiple external interfaces and parallel connections in a compact package.
• Power Single fixed voltage supply of 1.425 V (specified as 1.425 V to 1.425 V) for core operation.
• Package and Mounting 144-FPBGA (13×13) supplier device package in a surface-mount BGA format; packaged in tray for handling and assembly.
• Operating Range Commercial-grade operation from 0 °C to 85 °C.
• Manufacturer Produced by Microchip Technology, as part of the ProASIC3 family.

Typical Applications

• Prototyping and Custom Logic Designs that require up to 24,576 logic elements and flexible reprogrammable logic resources.
• I/O Expansion and Glue Logic Systems that need 97 available I/Os for interfacing and signal routing in a compact BGA footprint.
• On-Chip Memory Usage Applications that benefit from approximately 0.144 Mbits of embedded RAM for local buffering and temporary storage.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements and 1,000,000 gates deliver the resources needed for complex programmable logic tasks without moving to a larger package.
• Compact BGA Package: 144-FPBGA (13×13) provides a high-density mounting option that conserves board area while offering robust I/O count.
• Dedicated I/O Count: 97 I/Os support multiple external interfaces and parallel connections for flexible system integration.
• Embedded On-Chip RAM: Approximately 0.144 Mbits of RAM enables local buffering and memory-centric logic functions within the FPGA fabric.
• Commercial-Grade Availability: Specified for 0 °C to 85 °C operation and supplied in tray format to support production assembly processes.

Why Choose A3P1000-1FGG144?

The A3P1000-1FGG144 positions itself as a mid-range ProASIC3 FPGA option from Microchip Technology, delivering a balance of logic density, embedded memory, and I/O capability in a compact 144-FPBGA package. Its fixed 1.425 V core supply and commercial operating range make it suitable for production designs that require predictable power and temperature specifications.

This device is well-suited for engineers and teams needing scalable programmable logic resources, a respectable on-chip memory footprint, and nearly one hundred I/Os in a surface-mount BGA format. Its specification set supports designs where integration density and on-board reprogrammability are required while maintaining commercial-grade operating conditions.

Request a quote or submit a pricing inquiry to check availability and lead times for the A3P1000-1FGG144.