A3P1000-1FG484

The A3P1000-1FG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 24,576 logic elements and approximately 1,000,000 gates in a compact 484-FPBGA (23×23) surface-mount package.

Designed for commercial electronic systems that require programmable logic, the device offers a balance of logic capacity, on-chip memory, and high I/O density to support a range of embedded and board-level designs within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  Contains 24,576 logic elements, providing substantial programmable logic resources for complex custom designs.
• Gate Count  Approximately 1,000,000 gates to support a wide variety of logic implementations.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.147 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Density  300 user I/O pins to interface with peripherals, buses, and external components.
• Power Supply  Operates from a nominal supply range of 1.425 V to 1.575 V to match system-level power requirements.
• Package & Mounting  484-FPBGA (23×23) surface-mount package provides a compact, high-pin-count footprint for board-level integration.
• Operating Grade & Temperature  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content in manufacturing.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, interface bridging, and protocol handling using the device's logic elements and on-chip memory.
• Communications Equipment  High I/O count supports board-level interfaces and peripheral connections common in networking and telecom applications.
• Prototyping and Development  Programmable logic capacity and gate count make it suitable for hardware prototyping and iterative design refinement.
• Custom Logic Offload  Use the FPGA to offload deterministic tasks from microcontrollers or processors, leveraging available logic and memory resources.

Unique Advantages

• High Logic Density: The 24,576 logic elements enable implementation of sizable custom logic functions within a single device.
• Significant Gate Count: Approximately 1,000,000 gates provide the capacity to map complex designs without immediate need for multiple devices.
• On-Chip Memory: 147,456 bits (~0.147 Mbits) of embedded RAM supports buffering, state machines, and small data tables directly on-chip.
• Large I/O Capability: 300 I/O pins accommodate multiple external interfaces and parallel/peripheral connections for versatile board integration.
• Compact, High-Pin Package: The 484-FPBGA (23×23) surface-mount package delivers a high pin count in a compact footprint for space-constrained PCBs.
• Commercial Temperature Range & Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant to meet common commercial production requirements.

Why Choose A3P1000-1FG484?

The A3P1000-1FG484 positions itself as a capable commercial-grade FPGA option for designers who need a combination of substantial logic resources, on-chip memory, and high I/O density in a compact BGA package. Its defined supply voltage range and operating temperature make it suitable for a wide range of board-level applications in commercial products.

Engineers and procurement teams targeting scalable, programmable logic solutions will find this ProASIC3 device appropriate for designs that require integrated programmable logic, flexible interfacing, and RoHS-compliant manufacturing.

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