A3P1000-1FG256I

The A3P1000-1FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 256-ball BGA package. It offers a balanced combination of logic resources, on-chip memory, and I/O density targeted at embedded digital designs.

With 24,576 logic elements, roughly 1,000,000 gates, 177 I/Os, and an industrial operating temperature range, this device is positioned for applications that require on-chip configurability, integration, and reliable operation across a wide temperature span.

Key Features

• Core & Logic — 24,576 logic elements and a gate count of 1,000,000 provide substantial capacity for implementing custom digital logic and combinational/sequential designs.
• Embedded Memory — 147,456 bits of on-chip RAM, approximately 0.147 Mbits of embedded memory, for buffering, FIFOs, and small data stores within the FPGA fabric.
• I/O Density — 177 I/O pins to support multiple external interfaces, peripherals, and parallel/serial signaling requirements.
• Packaging & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Power — Core supply voltage range of 1.425 V to 1.575 V to match platform power rails and power-management schemes.
• Reliability & Temperature — Industrial grade device rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compliance — RoHS compliant, meeting commonly required environmental material restrictions.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating, abundant I/Os, and logic capacity for control logic, I/O aggregation, and custom state machines in factory automation.
• Embedded Processing & Glue Logic — Implement protocol bridges, glue logic, and custom processing blocks using the device’s 24,576 logic elements and on-chip RAM.
• Communications & Networking Equipment — Leverage the 177 I/Os and high gate count to build interface logic, packet buffering, or custom data-path functions.
• Test & Measurement — Deploy programmable logic and on-chip memory for instrument control, data capture, and signal-conditioning logic in rugged environments.

Unique Advantages

• High logic density: 24,576 logic elements and ~1,000,000 gates enable implementation of complex custom logic without external ASICs.
• Integrated on-chip memory: 147,456 bits of RAM (≈0.147 Mbits) for local buffering and low-latency data handling within the FPGA fabric.
• Generous I/O count: 177 I/Os simplify system integration by reducing the need for external multiplexing or I/O expanders.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation across a wide set of deployment environments.
• Compact, manufacturable package: 256-LBGA / 256-FPBGA (17×17) surface-mount package supports dense PCB layouts and automated assembly.
• Regulatory alignment: RoHS compliance supports environmentally restricted production requirements.

Why Choose A3P1000-1FG256I?

The A3P1000-1FG256I combines substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package, making it well suited for embedded designs that require programmable logic and robust operation across industrial temperature ranges. Its defined core voltage range and surface-mount package simplify board-level power and mechanical integration.

This device is appropriate for engineering teams building industrial control, communications, or embedded systems that need on-chip configurability and reliable performance. Backed by Microchip Technology’s ProASIC3 offering, it provides a practical option for projects demanding a balance of logic resources, I/O, and temperature-rated operation.

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