A3P1000-1FG144M

The A3P1000-1FG144M is a ProASIC3 field programmable gate array (FPGA) IC offering 24,576 logic elements and approximately 0.147 Mbits of on-chip RAM. Designed and qualified for military use, it provides a compact, surface-mount LBGA package and operating range suited to demanding embedded applications.

This device targets designs requiring high logic density, a defined core supply voltage, and verified MIL-STD-883 qualification for reliability across an extended temperature range.

Key Features

• Logic Capacity — 24,576 logic elements with a total of 1,000,000 gates to implement complex digital functions and custom logic.
• Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) for data buffering, state storage, and on-chip memory requirements.
• I/O Count — 97 general-purpose I/O pins to interface with peripheral devices and system buses.
• Power — Defined core voltage supply range of 1.425 V to 1.575 V to match tight power-rail requirements.
• Package & Mounting — 144-LBGA (supplier package 144-FPBGA, 13 × 13) in a surface-mount form factor for compact board layouts.
• Qualification & Grade — Military grade with MIL-STD-883 qualification for enhanced reliability and environmental assurance.
• Operating Temperature — Rated for −55 °C to 125 °C to support thermally demanding and wide-temperature environments.
• Compliance — RoHS compliant.

Typical Applications

• Military and Defense Systems — Suitable for mission-critical subsystems where MIL-STD-883 qualification and extended temperature operation are required.
• Rugged Embedded Control — Compact LBGA footprint and surface-mount mounting support dense board designs for embedded controllers in harsh environments.
• High-Density Logic Integration — Use the device’s 24,576 logic elements and 97 I/Os to consolidate multiple functions into a single FPGA for subsystem consolidation.
• Industrial Electronics — The extended operating temperature and military-grade qualification make the device applicable to industrial systems that require robust performance across temperature extremes.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and an operating range from −55 °C to 125 °C provide documented reliability for defense and rugged applications.
• High Logic Density: 24,576 logic elements and 1,000,000 gates enable implementation of complex digital functions within a single FPGA, reducing board-level complexity.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM supports local buffering and state storage without external memory.
• Compact Packaging: 144-LBGA (13 × 13 FPBGA) surface-mount package supports space-efficient PCB layouts for size-constrained systems.
• Defined Core Supply: A precise core voltage range (1.425 V to 1.575 V) simplifies power-rail planning and integration with system power supplies.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for lead-free assembly.

Why Choose A3P1000-1FG144M?

The A3P1000-1FG144M positions itself as a reliable, high-density FPGA option for military and rugged embedded applications. Its combination of 24,576 logic elements, on-chip RAM, MIL-STD-883 qualification, and wide operating temperature range makes it suited to designs that require durability and significant programmable logic in a compact package.

This device is ideal for engineers and procurement teams building defense, industrial, or rugged embedded systems that demand documented qualification, a clear core supply specification, and a compact LBGA footprint—providing long-term value through integration and robust environmental performance.

Request a quote or submit a purchase inquiry today to learn more about availability and lead times for the A3P1000-1FG144M.