A3P1000-1FGG256T

The A3P1000-1FGG256T is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for robust, board-level integration. It delivers 24,576 logic elements, approximately 0.15 Mbits of on-chip RAM and 177 user I/Os in a compact 256-ball BGA package.

With an automotive grade qualification (AEC-Q100), a wide operating temperature range and a tightly specified core voltage, this device targets applications that require reliable performance across challenging thermal and electrical environments.

Key Features

• Core Logic  24,576 logic elements (cells) and approximately 1,000,000 logic gates provide a scalable programmable fabric for complex digital functions.
• Embedded Memory  147,456 total RAM bits (approximately 0.15 Mbits) for on-chip buffering, state storage and fast local data access.
• I/O Density  177 user I/Os to support multiple parallel interfaces, sensor connections and board-level peripherals.
• Package & Mounting  256-ball LBGA package (supplier device package 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Power  Core supply specified from 1.425 V to 1.575 V to enable deterministic power planning and margining in system designs.
• Automotive Qualification & Temperature  Automotive grade device with AEC-Q100 qualification and an operating temperature range of –40°C to 125°C for deployment in temperature-stressed environments.
• Regulatory Compliance  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Automotive Control Systems  Suitable for in-vehicle digital control and interfacing thanks to AEC-Q100 qualification and a –40°C to 125°C operating range.
• Sensor Fusion and Signal Conditioning  High I/O count and on-chip RAM enable aggregation and preprocessing of multiple sensor streams at the board level.
• Embedded System Glue Logic  Dense logic resources and ample I/Os allow integration of custom interfaces, protocol bridges and timing-critical glue logic.
• Communications Front-End  Use the device’s programmable fabric and I/O density to implement protocol handling, framing and parallel interfacing functions.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and automotive grade designation enable confident use in temperature- and reliability-sensitive automotive subsystems.
• High Logic Density: 24,576 logic elements and ~1,000,000 gates provide capacity for complex custom logic while reducing the need for multiple discrete components.
• Flexible I/O Handling: 177 user I/Os support extensive board-level interfacing and reduce external multiplexing or I/O-expander requirements.
• Compact Board Footprint: 256-LBGA (256-FPBGA, 17×17) surface-mount package helps save PCB area while maintaining high pin count.
• Deterministic Power Specification: Narrow core supply range (1.425 V to 1.575 V) simplifies power-supply design and margining for reliable operation.
• Regulatory Compliance: RoHS compliance supports assembly and production requirements for lead-free manufacturing.

Why Choose A3P1000-1FGG256T?

The A3P1000-1FGG256T combines a substantial logic element count, on-chip RAM and a high I/O count in a compact automotive-qualified package. Its specified core voltage and wide operating temperature range make it suitable for designs that require predictable electrical behavior and durable thermal performance.

This device is well suited for engineers building automotive subsystems, sensor interfaces and embedded control logic where long-term robustness, scalable logic capacity and board-level integration matter. Backed by Microchip Technology’s ProASIC3 family pedigree, it offers a clear platform for designs that demand reliability and a dense programmable resource set.

Request a quote or contact sales to discuss pricing, availability and how the A3P1000-1FGG256T can fit into your next design.