A3P1000-1FGG484I

The A3P1000-1FGG484I is a ProASIC3 field programmable gate array (FPGA) IC offering a mid-range balance of logic capacity, on-chip memory, and I/O density in a compact BGA package. It provides 24,576 logic elements, approximately 147,456 bits of embedded memory, and 300 general-purpose I/O pins, making it suitable for complex programmable logic tasks.

Built to meet industrial thermal requirements and RoHS compliance, this device targets embedded and industrial applications that require a standardized supply voltage and reliable surface-mount packaging.

Key Features

• Core Logic  24,576 logic elements and approximately 1,000,000 gates for mid-range programmable logic implementation.
• Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support data buffering and state storage.
• I/O Density  300 user I/O pins to accommodate multiple parallel interfaces, sensor arrays, and peripheral connections.
• Power  Specified supply voltage range from 1.425 V to 1.575 V for consistent core operation.
• Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting type for compact board integration.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for many industrial-environment deployments.
• Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Interfaces to sensors and actuators using high I/O count and robust temperature rating for factory or process automation equipment.
• Embedded Systems  Implements mid-range custom logic and data handling where on-chip memory and programmable logic elements reduce external component count.
• Data Acquisition & Instrumentation  Supports parallel data capture and preprocessing with ample I/O and embedded RAM for short-term buffering.
• Communications Interfaces  Provides flexible I/O and logic resources for protocol bridging, signal conditioning, or peripheral aggregation.

Unique Advantages

• High logic capacity: 24,576 logic elements enable complex state machines and custom datapaths without excessive external logic.
• Generous I/O count: 300 I/O pins simplify board-level integration of multiple peripherals and interfaces.
• On-chip memory: Approximately 0.147 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Industrial-ready thermal range: Rated from -40 °C to 100 °C to support deployment in demanding environments.
• Compact BGA packaging: 484-FPBGA (23×23) surface-mount package provides a space-efficient footprint for dense PCB layouts.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose A3P1000-1FGG484I?

The A3P1000-1FGG484I combines a substantial count of logic elements, significant on-chip RAM, and a high I/O complement in a compact 484-BGA package rated for industrial temperatures. This combination makes it a practical choice for engineers designing embedded and industrial systems that need programmable logic, local memory, and reliable operation across a wide temperature range.

Use this device where a mid-range FPGA solution is required to consolidate functionality, reduce external components, and deliver predictable operation within a defined supply voltage window.

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