A3P1000-1PQ208I

The A3P1000-1PQ208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC offering 24,576 logic elements and 147,456 bits of on-chip RAM in a 208-BFQFP package. It is supplied in a 208-pin PQFP footprint (28×28) and is specified for industrial-grade use.

Designed for applications that require reprogrammable logic, embedded memory and a substantial I/O count, this device provides a balance of logic capacity, I/O density and compact surface-mount packaging for industrial and embedded system designs.

Key Features

• Logic Capacity – 24,576 logic elements delivering roughly 1,000,000 logic gates for implementing complex digital functions.
• Embedded Memory – Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density – 154 general-purpose I/O pins providing flexible external interfacing options for peripherals and system signals.
• Power – Core supply voltage range specified at 1.425 V to 1.575 V for predictable power planning and system integration.
• Package & Mounting – 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor suitable for compact PCBs.
• Temperature Range – Industrial operating temperature range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance – RoHS compliant, meeting standard lead-free manufacturing requirements.

Typical Applications

• Industrial Systems – Programmable logic and I/O consolidation for industrial control and automation equipment where industrial-grade components are required.
• Embedded Processing – Local digital processing and glue-logic functions in embedded platforms that benefit from on-chip RAM and moderate logic density.
• Interface and I/O Control – High-density I/O applications requiring flexible pin count and surface-mount packaging for compact designs.

Unique Advantages

• Substantial Logic Density: 24,576 logic elements and ~1,000,000 gates provide ample resources for complex logic implementations within a single device.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High I/O Count: 154 I/O pins support multiple peripheral interfaces and signal routing without extensive external components.
• Industrial Temperature Support: Rated for -40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) allows high-density PCB layouts while remaining compatible with standard surface-mount assembly processes.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for modern production standards.

Why Choose A3P1000-1PQ208I?

The A3P1000-1PQ208I positions itself as a capable industrial-grade FPGA solution combining moderate-to-high logic resources, embedded memory and a generous I/O complement in a compact 208-BFQFP surface-mount package. Its specified core voltage range and industrial temperature rating make it suitable for engineers designing robust embedded and industrial systems that require reprogrammable logic and local memory.

This part is well suited to teams who need a single-device solution to implement complex glue logic, interface control and localized data handling while maintaining a compact PCB footprint and RoHS-compliant manufacturing.

Request a quote or submit your requirements to receive pricing and availability for the A3P1000-1PQ208I. Our team will respond with a tailored quote and lead-time information.