A3P1000-1PQ208M

The A3P1000-1PQ208M is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offered in a 208-BFQFP surface-mount package. It provides 24,576 logic elements, approximately 0.147 Mbits of embedded memory, 1,000,000 gates and 154 user I/Os, targeting designs that require a high logic count, significant I/O capacity and military-grade qualification.

With a specified supply voltage window of 1.425 V to 1.575 V and an operating temperature range of −55 °C to 125 °C, this device is intended for applications that demand robust environmental performance and MIL-STD-883 qualification.

Key Features

• Logic Capacity  24,576 logic elements (CLBs) and 1,000,000 gates provide the fabric for complex digital designs and logic-intensive functions.
• On-chip Memory  147,456 total RAM bits, approximately 0.147 Mbits of embedded memory for buffering, state storage and localized data processing.
• I/O Count  154 user I/Os to support wide peripheral and interface connectivity from a single-device solution.
• Power Supply  Narrow core supply range of 1.425 V to 1.575 V for defined power rail design and predictable device behavior.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount format for board-level integration and assembly.
• Temperature & Qualification  Military grade with MIL-STD-883 qualification and an operating temperature range of −55 °C to 125 °C for demanding environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Military and Aerospace Systems  Suitable for systems requiring MIL-STD-883 qualification and wide temperature operation, where board-level FPGA functionality must meet rugged environmental requirements.
• High-density Signal Processing  Used for control and signal-processing tasks that benefit from 24,576 logic elements and on-chip RAM for localized data handling.
• I/O-Intensive Interface Modules  Ideal for designs that require many external interfaces or protocol bridging, leveraging 154 user I/Os and a compact 208-BFQFP package.

Unique Advantages

• Military-grade Qualification: MIL-STD-883 qualification assures traceable qualification status for defense and other regulated programs.
• High Logic Density: 24,576 logic elements and 1,000,000 gates enable substantial on-chip logic integration, reducing the need for additional discrete logic devices.
• Significant On-chip Memory: Approximately 0.147 Mbits of embedded RAM supports buffering and state retention without external memory.
• Robust Thermal Range: Operation from −55 °C to 125 °C allows deployment in environments with extreme temperature variation.
• Defined Power Requirements: A narrow core supply range (1.425 V–1.575 V) simplifies power rail design and verification.
• RoHS Compliant: Meets lead-free assembly requirements for regulated manufacturing processes.

Why Choose A3P1000-1PQ208M?

The A3P1000-1PQ208M combines substantial logic density, embedded memory and a high I/O count within a military-qualified FPGA package. Its defined supply window and wide operating temperature range make it a pragmatic choice for engineers designing systems that require dependable digital integration under demanding environmental conditions.

This device is suited to programs where long-term robustness, qualification traceability and on-board integration reduce system-level complexity and component count, supporting streamlined designs and predictable performance over the product lifecycle.

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