A3P1000-1FGG484T

The A3P1000-1FGG484T is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density programmable fabric with 24,576 logic elements and approximately 1,000,000 gates, combined with on-chip embedded memory and a large I/O count.

Qualified to AEC-Q100 and rated for operation from -40°C to 125°C, this device is targeted where qualified, temperature-tolerant programmable logic is required. The device is supplied in a compact 484-ball BGA (484-FPBGA, 23×23) surface-mount package and operates from a 1.425 V to 1.575 V core supply.

Key Features

• Programmable Logic Capacity — 24,576 logic elements (LABs/CLBs equivalent) providing approximately 1,000,000 gates for implementing complex logic functions.
• Embedded Memory — 147,456 total RAM bits, approximately 0.147 Mbits of on-chip embedded memory for buffering, state storage, and local data handling.
• I/O Density — 300 I/Os to support extensive external interfacing and system-level integration without large external glue logic.
• Automotive Qualification — AEC-Q100 qualification and an operating temperature range of -40°C to 125°C for use in temperature-demanding environments.
• Power — Core supply range of 1.425 V to 1.575 V to match low-voltage system designs.
• Package & Mounting — 484-BGA package (supplier device package: 484-FPBGA, 23×23) with surface-mount mounting type for compact board-level implementation.
• Compliance — RoHS-compliant manufacturing status.

Typical Applications

• Automotive electronic systems — AEC-Q100 qualification and an extended temperature range enable deployment in vehicle electronics that require qualified programmable logic.
• High-I/O control and interfacing — 300 I/Os support systems that require numerous external connections for sensors, actuators, and peripherals.
• Logic-dense subsystems — 24,576 logic elements and ~1,000,000 gates accommodate complex combinational and sequential logic implementations.
• On-chip buffering and local memory — Approximately 0.147 Mbits of embedded RAM for local data storage and real-time buffering needs.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 rating and -40°C to 125°C operating range provide documented suitability for temperature-challenging applications.
• High integration density: Large logic element count and one million gates reduce the need for multiple discrete devices in logic-intensive designs.
• Extensive I/O resources: 300 available I/Os simplify system-level integration and minimize external interface components.
• Compact BGA footprint: 484-FPBGA (23×23) package offers a space-efficient solution for board layouts requiring high pin-count devices.
• Low-voltage core operation: 1.425 V to 1.575 V supply range aligns with modern low-voltage digital systems.
• RoHS compliance: Environmentally compliant manufacturing status supports regulatory requirements.

Why Choose A3P1000-1FGG484T?

The A3P1000-1FGG484T delivers a balanced combination of logic density, embedded memory, and high I/O count in an automotive-qualified FPGA package. Its qualification to AEC-Q100 and wide operating temperature range make it appropriate for qualified systems that must perform reliably across demanding temperature conditions.

This device is well suited for designers who require substantial on-chip programmable logic and I/O integration within a compact BGA footprint, while maintaining compliance and qualification for temperature-sensitive environments. Its specification set supports long-term design stability and integration into systems needing qualified programmable logic.

Request a quote or submit a product inquiry to receive pricing, lead-time information, or additional technical support for the A3P1000-1FGG484T.