A3P1000-1FGG256M

The A3P1000-1FGG256M is a ProASIC3 field programmable gate array from Microchip Technology, delivered in a 256-LBGA package. It provides a mid-range logic capacity with integrated memory and a high I/O count for applications that require military-grade qualification and wide operating temperature range.

Designed for systems where reliability and controlled supply voltages matter, this FPGA combines approximately 24,576 logic elements, approximately 147,456 bits of embedded memory, and 177 I/O pins in a surface-mount 256-FPBGA (17 × 17) package.

Key Features

• Logic Capacity  Approximately 24,576 logic elements and an estimated 1,000,000 gates to implement medium-complexity digital designs.
• Embedded Memory  Approximately 147,456 bits of on-chip RAM to support buffering, state machines, and small data stores without external memory.
• I/O Density  177 user I/Os enabling multiple peripheral interfaces, bus connects, and high-pin-count system integration.
• Package & Mounting  Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17 × 17) for compact board-level integration and thermal performance consistent with BGA construction.
• Power  Operates from a supply range of 1.14 V to 1.575 V, suitable for designs that require low-voltage core operation.
• Qualification & Grade  Military grade device with qualification to MIL-STD-883 for environments demanding higher reliability and screening.
• Operating Temperature  Rated for −55 °C to 125 °C to support high-reliability and harsh-environment deployments.
• Compliance  RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Aerospace & Defense Systems  Military-qualified FPGA for control, signal processing, and interface consolidation in defense electronics.
• High-Reliability Instrumentation  Embedded logic and on-chip RAM suitable for test equipment and rugged instrumentation requiring extended temperature ranges.
• Communications Equipment  Use as a protocol handler or custom interface bridge where multiple I/Os and integrated memory simplify board design.
• Embedded Control  Implement finite-state machines, timing-critical logic, and peripheral control in compact, surface-mount form factors.

Unique Advantages

• Military Qualification: MIL-STD-883 qualification and military grade designation provide confidence for defense and high-reliability programs.
• Balanced Logic and Memory: A combination of approximately 24,576 logic elements and roughly 147,456 bits of embedded RAM enables varied digital functions without always requiring external memory.
• High I/O Count: 177 I/Os allow consolidation of multiple interfaces and reduce the need for external glue logic.
• Wide Operating Temperature: Rated from −55 °C to 125 °C for deployment in demanding thermal environments.
• Compact BGA Packaging: 256-LBGA (256-FPBGA, 17 × 17) supports high-density PCB layouts and reliable surface-mount assembly.
• Low-Voltage Core Operation: 1.14 V to 1.575 V supply range supports low-voltage system architectures and modern power domains.

Why Choose A3P1000-1FGG256M?

The A3P1000-1FGG256M is positioned for engineers who require a military-qualified FPGA with a practical balance of logic, memory, and I/O in a compact BGA package. Its qualification to MIL-STD-883, wide temperature rating, and RoHS compliance make it suitable for demanding, long-life applications where part traceability and environmental compliance are required.

This device is a suitable option for teams designing mid-complexity digital systems that need integrated RAM, abundant I/Os, and a proven package form factor from Microchip Technology.

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