A3P1000-2FG484

The A3P1000-2FG484 is a ProASIC3 family FPGA from Microchip Technology, implemented in a 484-ball fine-pitch BGA package. It provides a mid-range programmable logic fabric with 24,576 logic elements, approximately 147,456 bits of embedded RAM, and up to 300 user I/O pins for I/O‑heavy commercial embedded systems.

With a supply range of 1.425 V to 1.575 V and a commercial operating temperature of 0 °C to 85 °C, this surface-mount device is suited for designs that require significant on-chip logic and memory capacity in a compact BGA footprint.

Key Features

• Core Logic  24,576 logic elements (cells) providing approximately 1,000,000 gates of programmable logic capacity for custom digital designs.
• Embedded Memory  Approximately 147,456 bits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density  300 user I/O pins to support high-pin-count interfaces, parallel buses, and multi-channel connectivity in a single device.
• Package  484-ball FPBGA (23 × 23 mm) surface-mount package for compact board placement and high pin count in a small footprint.
• Power  Core supply voltage range of 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
• Commercial Grade & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS‑compliant manufacturing.

Typical Applications

• Commercial Embedded Systems  Implement custom processing, protocol bridging, and control logic where mid-range logic density and on-chip RAM are required.
• I/O-Intensive Interfaces  Drive parallel buses, multi-channel sensor arrays, or interface bridging that benefit from up to 300 user I/O pins.
• Prototyping and Evaluation  Validate and iterate digital designs that need a sizeable logic element count and embedded memory in a compact package.
• Peripheral Integration  Consolidate glue logic and peripheral controllers into a single programmable device to reduce component count.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements enable implementation of complex state machines, custom processors, and parallel data paths without external ASICs.
• On-Chip RAM: Approximately 147,456 bits of embedded memory reduce dependence on external memory for buffering and local storage.
• High I/O Count: 300 user I/O pins allow direct interfacing to multiple peripherals and high-channel-count systems from a single device.
• Compact BGA Packaging: 484-FPBGA (23 × 23 mm) provides high pin density in a compact surface-mount form factor for space-constrained PCBs.
• Controlled Power Envelope: A defined core voltage range (1.425 V–1.575 V) simplifies power supply design and integration with existing system rails.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory and supply-chain requirements for commercial products.

Why Choose A3P1000-2FG484?

The A3P1000-2FG484 balances mid-range programmable logic density with a high I/O count and on-chip memory in a compact 484-ball BGA package, making it well suited for commercial embedded designs that require significant integration without external ASICs or large PCBs. Its defined supply range and commercial temperature rating help streamline power and thermal planning for production systems.

Engineers designing solutions that need roughly 1,000,000 gates, 24,576 logic elements, approximately 147,456 bits of embedded RAM and up to 300 I/O will find this Microchip Technology ProASIC3 device appropriate for consolidating logic, reducing BOM, and maintaining a small board footprint.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the A3P1000-2FG484.