A3P1000-2FGG144I

The A3P1000-2FGG144I is a ProASIC3 field programmable gate array (FPGA) supplied in a 144-LBGA package. It integrates 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and 97 general-purpose I/O pins to address medium-density programmable-logic requirements.

Designed for industrial applications, this surface-mount FPGA offers a compact package, a defined core voltage range, and an extended operating temperature span to support reliable operation in demanding environments.

Key Features

• Core Capacity  24,576 logic elements (logic cells) providing up to 1,000,000 gates of programmable logic for implementing custom digital functions.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM for small FIFOs, buffering, and local data storage.
• I/O Resources  97 user I/O pins suitable for connecting external peripherals, buses, and interfaces.
• Power Supply  Specified core supply range of 1.425 V to 1.575 V to match the device's defined operating voltage requirements.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact, high-density PCB designs.
• Operating Temperature  Industrial-grade temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliance  Device is RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Control Logic  Implement customizable control sequences and interface logic using 24,576 logic elements and 97 I/Os within an industrial temperature window.
• Protocol Bridging and I/O Expansion  Create protocol bridges or expand I/O functionality where compact on-board programmability and 97 I/Os are required.
• Embedded System Glue Logic  Replace fixed-function glue logic with reprogrammable logic to consolidate discrete components and simplify board design.

Unique Advantages

• Substantial Logic Density: 24,576 logic elements and roughly 1,000,000 gates enable implementation of medium-complexity digital designs without external ASICs.
• Compact BGA Footprint: 144-LBGA (13×13) package supports space-constrained PCBs while providing a high pin count for flexible routing.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C to maintain operation in industrial environments and temperature-stressed installations.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM for localized buffering and small data-store needs, reducing external memory requirements.
• Defined Core Supply: Operates with a specified 1.425 V to 1.575 V supply to align with targeted system power architectures.
• RoHS Compliant: Supports lead-free production processes and regulatory requirements for environmentally conscious manufacturing.

Why Choose A3P1000-2FGG144I?

The A3P1000-2FGG144I positions itself as a versatile, industrial-grade FPGA option for designers who need moderate logic capacity, on-chip RAM, and a compact BGA package. Its combination of 24,576 logic elements, roughly 0.147 Mbits of embedded memory, and 97 I/Os makes it suitable for consolidating interface logic and implementing custom digital blocks in industrial and embedded systems.

Engineering teams seeking a reprogrammable solution with defined voltage and temperature specifications will find this device useful for projects that demand predictable electrical and environmental behavior, compact board integration, and RoHS-compliant manufacturing.

Request a quote or submit your requirements to receive pricing and availability for the A3P1000-2FGG144I. Our team will provide a tailored response for volume needs and lead-time information.