A3P1000-2FGG484

The A3P1000-2FGG484 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides a high-density programmable logic fabric with abundant I/O and embedded memory in a compact 484-ball BGA package for commercial electronic designs.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and up to 300 user I/Os, this device addresses applications that require significant on-chip logic, connectivity, and compact surface-mount packaging while operating within a commercial temperature range.

Key Features

• Core / Logic  24,576 logic elements delivering up to 1,000,000 gates of programmable logic for complex digital functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for local data storage and buffering.
• I/O Capacity  Up to 300 user I/O pins to support a wide range of interfaces and external peripherals.
• Power  Core supply operating range from 1.425 V to 1.575 V to match system power rails and design requirements.
• Package & Mounting  484-ball fine-pitch BGA (484-FPBGA, 23×23) in a surface-mount package for compact board integration.
• Operating Conditions & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliance for environmental standards.

Typical Applications

• Embedded digital logic  Implement custom state machines, protocol handlers, and glue logic where on-chip programmability is required.
• I/O expansion and interface bridging  Provide high-density I/O to aggregate or translate between multiple peripherals and subsystems.
• Compact system integration  Use the 484-BGA package to integrate significant programmable logic in space-constrained commercial products.

Unique Advantages

• High logic density: 24,576 logic elements and 1,000,000 gates enable complex designs without multiple discrete components.
• Substantial I/O resources: 300 user I/Os support diverse external interfaces and high-pin-count connectivity.
• On-chip memory: Approximately 0.147 Mbits of embedded RAM for local buffering and state storage, reducing external memory needs.
• Compact surface-mount package: 484-FPBGA (23×23) provides a dense, manufacturable footprint for modern PCB layouts.
• Commercial operating range with RoHS compliance: Designed for standard commercial applications and compliant with environmental regulations.

Why Choose A3P1000-2FGG484?

The A3P1000-2FGG484 packages substantial programmable logic, significant I/O, and embedded memory into a compact 484-ball BGA package from Microchip Technology. Its specification set addresses commercial designs that need dense logic resources and flexible connectivity in a surface-mount form factor.

This device is well suited for engineers building commercial embedded systems who require on-chip programmability, a high number of I/Os, and a reliable platform backed by a recognized FPGA family. Its combination of logic capacity, memory, and package density supports scalable design choices and streamlined board-level integration.

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