A3P1000-2FGG256M

The A3P1000-2FGG256M is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for high-reliability applications. It provides a high gate count and a substantial number of logic elements alongside a broad I/O complement, packaged in a 256-ball low-profile BGA for surface-mount assembly.

Targeted at military and other high-reliability embedded systems, this device delivers the integration and temperature range required for demanding operating environments while meeting MIL-STD-883 qualification.

Key Features

• Logic Capacity — 24,576 logic elements (equivalent logic cells) and 1,000,000 gates to implement complex digital functions.
• Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, state storage, and scratchpad usage.
• IO Count — 177 user I/O pins to support multiple peripherals, sensors, and high-density board interfaces.
• Power Supply — Core voltage range from 1.14 V to 1.575 V to match system power domains.
• Package & Mounting — 256-LBGA (supplier package 256-FPBGA 17×17) in a surface-mount form factor suitable for compact, high-density designs.
• Temperature & Qualification — Military-grade device with operating range from -55 °C to 125 °C and MIL-STD-883 qualification for use in harsh environments.
• Environmental Compliance — RoHS-compliant material status.

Typical Applications

• Defense Systems — Implement mission logic, protocol handling, and I/O aggregation where MIL-STD-883 qualification and wide temperature range are required.
• Aerospace & Avionics — Support avionics control, data routing, and interface bridging with a high gate count and 177 I/Os for diverse subsystems.
• High-Reliability Embedded Control — Use as a central logic device in embedded platforms that require robust operation from -55 °C to 125 °C.

Unique Advantages

• High-density logic integration: 24,576 logic elements and 1,000,000 gates enable complex functions to be consolidated into a single FPGA, reducing system-level component count.
• Sufficient embedded memory: Approximately 0.147 Mbits of on-chip RAM provides local storage for buffering, registers, and small data structures without external memory.
• Large I/O capacity: 177 I/Os accommodate multiple interfaces and peripheral connections, simplifying board routing and integration.
• Military qualification and wide temperature range: MIL-STD-883 qualification and -55 °C to 125 °C operation support deployment in harsh, mission-critical environments.
• Compact, manufacturable package: 256-LBGA (17×17 FPBGA) surface-mount package enables high-density PCB layouts and standard assembly processes.
• RoHS compliant: Meets common environmental material requirements for regulated assemblies.

Why Choose A3P1000-2FGG256M?

The A3P1000-2FGG256M combines high logic density, significant I/O resources, and on-chip memory in a military-qualified FPGA from Microchip Technology. Its specifications are aligned to applications that demand reliability across extreme temperatures and formal MIL-STD-883 qualification.

This device is well suited for designers building defense, aerospace, and other high-reliability embedded systems who require a compact, surface-mount FPGA with verified qualification and a balance of logic, memory, and I/O resources.

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