A3P1000-2FGG484I

The A3P1000-2FGG484I is a ProASIC3 family field programmable gate array (FPGA) designed for industrial-grade applications. It provides a balance of logic density, embedded memory, and I/O capacity in a compact 484-ball BGA package.

With 24,576 logic elements (cells), approximately 0.147 Mbits of embedded RAM, and 300 I/O pins, this device suits designs that require a mid-range programmable fabric delivered with industrial temperature capability and RoHS compliance.

Key Features

• Core Logic  24,576 logic elements (cells) and approximately 1,000,000 gates provide programmable logic capacity for custom digital functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for data buffering, FIFOs, and small lookup tables.
• Rich I/O  300 user I/O pins to support dense external connectivity for interfaces and peripherals.
• Power Supply  Specified operating supply voltage range from 1.425 V to 1.575 V for core power planning.
• Package & Mounting  484-ball Fine-Pitch BGA (484-FPBGA, 23 × 23) in a surface-mount format for compact PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C to meet robust environmental requirements.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Industrial Control and Automation  Use the programmable logic and wide temperature range for control algorithms, I/O handling, and custom timing in automation equipment.
• Embedded System Integration  Implement glue logic, protocol handling, and custom peripherals where mid-range logic density and substantial I/O are required.
• Communication Interfaces  Deploy the device for protocol bridging, signal conditioning, or bus interfacing tasks that benefit from many I/O pins and on-chip memory.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements and ~1,000,000 gates enable implementation of sizable custom logic blocks without external PLDs.
• Ample I/O Count: 300 I/O pins simplify system-level connectivity and reduce the need for external multiplexing or expanders.
• Compact BGA Footprint: 484-FPBGA (23 × 23) package provides a high I/O density in a surface-mount form factor for space-constrained PCBs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in demanding ambient conditions.
• Controlled Core Voltage: Narrow supply range (1.425 V–1.575 V) supports predictable power design and regulation.
• RoHS Compliance: Environmentally compliant manufacturing supports green production requirements.

Why Choose A3P1000-2FGG484I?

The A3P1000-2FGG484I positions itself as a robust mid-range FPGA option that combines a meaningful logic element count, on-chip RAM, and extensive I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived, environmentally demanding deployments where predictable electrical and thermal behavior is required.

This device is well suited for design teams building control systems, embedded platforms, and interface-rich equipment that require a programmable, scalable hardware element with clear electrical and mechanical characteristics.

Request a quote or submit an inquiry to get pricing and availability for the A3P1000-2FGG484I and discuss how it can be incorporated into your next design.