A3P1000-FGG256T

The A3P1000-FGG256T is a ProASIC3 family flash-based FPGA from Microchip Technology. It integrates a large fabric—approximately 1,000,000 gates and 24,576 logic elements—along with on-chip embedded memory and a broad complement of I/O for complex programmable logic tasks.

Designed for applications that require high I/O count, significant combinational and sequential logic capacity, and automotive-grade qualification, this device delivers configurable logic, on-chip RAM and a compact 256-LBGA surface-mount package with operation across a wide temperature and voltage range.

Key Features

• Logic Capacity  Approximately 24,576 logic elements and 1,000,000 gates provide substantial programmable logic resources for mid-to-high complexity designs.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for data buffering, state storage and small lookup tables.
• I/O Density  177 user I/O pins support extensive peripheral interfacing and parallel/serial connectivity requirements.
• Package & Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Supply & Operating Range  Designed to operate from a core supply of 1.425 V to 1.575 V and across an extended temperature range of -40°C to 125°C.
• Automotive Qualification  AEC-Q100 qualification and automotive grade designation for designs requiring industry-recognized automotive reliability standards.
• Environmental Compliance  RoHS compliant for conformity with common environmental/regulatory requirements.

Typical Applications

• Automotive electronic control modules  AEC-Q100 qualification and -40°C to 125°C operation make the device suitable for in-vehicle control tasks that need programmable logic and multiple I/Os.
• Sensor interfacing and signal aggregation  High I/O count and embedded memory enable aggregation, preprocessing and routing of sensor data in compact FPGA-based controllers.
• Protocol bridging and custom I/O  Programmable fabric and abundant I/Os allow implementation of custom protocol translators and glue logic between subsystems.

Unique Advantages

• Substantial programmable capacity: The combination of ~24,576 logic elements and 1,000,000 gates supports complex state machines, datapaths and control logic in a single device.
• Compact, high-density package: 256-LBGA (17×17) surface-mount packaging minimizes PCB footprint while retaining high I/O count for compact system designs.
• Automotive-capable robustness: AEC-Q100 qualification plus extended -40°C to 125°C operation helps ensure reliable performance in demanding automotive environments.
• Predictable power window: Narrow core supply range (1.425 V to 1.575 V) simplifies power-rail planning for consistent device operation.
• Regulatory readiness: RoHS compliance facilitates integration into products targeting common environmental standards.

Why Choose A3P1000-FGG256T?

The A3P1000-FGG256T positions itself as a robust, automotive-qualified flash FPGA that combines significant logic capacity, embedded memory and a high pin-count package for designers who need configurable hardware in space-constrained systems. Its AEC-Q100 qualification and extended operating temperature range make it appropriate for applications where automotive-level reliability is required.

This device is well suited to customers developing in-vehicle electronics, sensor interfaces, protocol bridging solutions and other embedded systems that benefit from a large, reprogrammable logic fabric supported by a compact LBGA footprint and defined supply/temperature specifications. Backed by Microchip Technology, it provides a clear specification set for long-term designs that demand reproducible behavior and qualification traceability.

Request a quote or submit an inquiry to get pricing and availability for the A3P1000-FGG256T and discuss how it fits your next design.