A3P1000-FGG484I

The A3P1000-FGG484I is a ProASIC3 FPGA from Microchip Technology designed for programmable logic implementations requiring a balance of logic density, I/O count and industrial temperature capability. It provides 24,576 logic elements, approximately 0.15 Mbits of embedded RAM, and 300 user I/Os in a 484-ball BGA package.

This device targets designs that need substantial on-chip logic and I/O integration while operating across a wide supply and temperature range, making it suitable for demanding embedded and industrial environments.

Key Features

• Core Logic  24,576 logic elements (logic cells) and 1,000,000 gates provide programmable logic capacity for complex finite-state machines, glue logic and custom datapaths.
• Embedded Memory  147,456 bits of on-chip RAM — approximately 0.15 Mbits — for buffering, FIFOs and small data storage directly within the FPGA fabric.
• I/O  300 user I/Os to support high pin-count interfaces and board-level connectivity needs.
• Power  Specified core supply range of 1.425 V to 1.575 V to match system power rails and ensure stable operation within the defined voltage window.
• Package & Mounting  484-ball BGA (supplier device package: 484-FPBGA 23×23) in a surface-mount form factor for compact, high-density board designs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in harsh environments.
• Mounting Type  Surface mount device suitable for modern PCB assembly processes.
• Manufacturer  Produced by Microchip Technology, offering consistent supply and component traceability.

Typical Applications

• Logic-Intensive Embedded Systems  Use the device’s 24,576 logic elements to implement custom control, protocol bridging or medium-complexity datapaths on a single chip.
• High-Density I/O Control  With 300 I/Os, the FPGA is well suited for board-level I/O expansion, parallel interface aggregation and multi-channel sensor or actuator control.
• Memory Buffering and Data Flow  Approximately 0.15 Mbits of embedded RAM can be used for buffering, small FIFOs and temporary data storage in streaming or packet-handling applications.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements provide the resources to implement complex logic functions without immediate need for additional FPGAs.
• Ample I/O Availability: 300 user I/Os reduce external interface components and simplify PCB routing for multi-channel systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA Package: 484-BGA (23×23 FPBGA) enables high-density board designs while maintaining robust electrical and thermal characteristics.
• Defined Supply Window: Operates from 1.425 V to 1.575 V, allowing designers to plan power delivery and decoupling precisely.
• Manufacturer Provenance: Microchip Technology manufacturing offers component traceability and consistency for production designs.

Why Choose A3P1000-FGG484I?

The A3P1000-FGG484I delivers a balanced combination of logic density, embedded RAM and I/O count in a compact BGA package, suited to embedded and industrial applications that demand reliable operation across a wide temperature range. Its defined voltage supply and surface-mount 484-ball package make it a practical choice for designers consolidating logic and interface functions on a single device.

This FPGA is appropriate for engineering teams building medium-complexity programmable logic solutions where integration, predictable thermal and electrical characteristics, and Microchip Technology’s manufacturing consistency support production-ready deployments.

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