A3P1000-FGG484M

The A3P1000-FGG484M is a ProASIC3 field programmable gate array (FPGA) offered by Microchip Technology, delivered in a 484-ball BGA surface-mount package. It provides a balance of logic capacity, I/O density and on-chip memory for military and high-reliability embedded designs.

With 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 300 I/Os, this FPGA is positioned for applications that require deterministic behavior across a wide operating temperature range and MIL-STD-883 qualification.

Key Features

• Core Logic  24,576 logic elements and 1,000,000 gates provide substantial programmable logic capacity for custom functions and glue-logic integration.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) to support buffering, state machines and small data structures.
• I/O Density  300 general-purpose I/Os to accommodate multi-channel interfaces, parallel buses and peripheral connectivity.
• Power Supply  Designed for a supply voltage range of 1.425 V to 1.575 V to match system power rails and design requirements.
• Package & Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
• Temperature & Qualification  Military-grade device rated for operation from -55 °C to 125 °C and qualified to MIL-STD-883 for high-reliability applications.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Military & Defense Systems  Used where MIL-STD-883 qualification and extended temperature range are required for rugged, mission-critical electronics.
• Aerospace & Avionics  Suitable for avionics subsystems that demand reliable programmable logic and a compact BGA footprint.
• Industrial Control  Applied in high-reliability industrial controllers and automation equipment operating across extreme temperature ranges.
• Custom Digital Processing  Deployed for application-specific processing tasks, interface bridging and system glue logic using available logic elements and I/Os.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and a -55 °C to 125 °C operating range support deployment in harsh and mission-critical environments.
• Substantial Logic Capacity: 24,576 logic elements and 1,000,000 gates enable integration of complex custom logic without external ASICs.
• High I/O Count: 300 I/Os provide flexibility to interface with multiple peripherals, sensors and high-pin-count systems.
• Compact BGA Package: 484-BGA (484-FPBGA, 23×23) supports dense board layouts while maintaining robust soldered connections for surface-mount assembly.
• Controlled Power Envelope: Narrow supply voltage window (1.425 V to 1.575 V) eases power-rail design and consistency across deployed units.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for many programs and installations.

Why Choose A3P1000-FGG484M?

The A3P1000-FGG484M offers a military-grade FPGA solution that combines a significant logic element count, a high I/O count and qualified reliability for demanding embedded applications. Its operating temperature range and MIL-STD-883 qualification make it suitable for designs that require predictable behavior in harsh conditions.

This device is well suited to engineers and program managers who need a compact, high-density programmable logic device for defense, aerospace, industrial or other high-reliability systems where long-term robustness and deterministic operation are priorities.

Request a quote or submit an inquiry to evaluate the A3P1000-FGG484M for your next high-reliability FPGA design.