A3P1000-PQ208M

The A3P1000-PQ208M is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides a high-density, military-qualified FPGA fabric with a large number of logic elements and on-chip memory for embedded digital processing.

Designed for applications that require extended temperature operation and formal military qualification, this device offers a combination of high logic capacity, substantial I/O count, and a compact 208-BFQFP package for surface-mount integration.

Key Features

• Core Logic  Approximately 1,000,000 gates implemented as 24,576 logic elements to support complex digital designs and custom logic implementations.
• On-Chip Memory  Total embedded memory of 147,456 bits (approximately 0.147 Mbits) for data buffering, state storage, and small local FIFOs.
• I/O Density  154 user I/O pins to connect peripherals, sensors, and external logic while keeping routing localized on-board.
• Package and Mounting  208-BFQFP package (supplier device package 208-PQFP, 28×28 mm) in a surface-mount form factor suitable for board-level assembly.
• Power  Core supply operating range from 1.425 V to 1.575 V for predictable power planning and regulator selection.
• Temperature Range  Qualified for operation from −55°C to 125°C, supporting deployment in thermally demanding environments.
• Military Qualification  Grade: Military with MIL-STD-883 qualification for use in applications requiring formal testability and reliability standards.
• Environmental Compliance  RoHS compliant to meet lead-free and hazardous-substance requirements.

Typical Applications

• Military and Defense Systems  Suitable for avionics, tactical electronics, and other defense applications where MIL-STD-883 qualification and extended temperature range are required.
• Rugged Embedded Control  Used in embedded controllers and mission-critical processing nodes that need high logic capacity and reliable operation across extreme temperatures.
• Communication and Signal Processing  Applicable to secure communications and signal-handling modules that benefit from abundant logic elements and on-chip memory for buffering.

Unique Advantages

• Military-Qualified Platform: MIL-STD-883 qualification and military grade designation provide formal reliability credentials for defense and high-reliability programs.
• High Logic Capacity: 24,576 logic elements and about 1,000,000 gates enable complex custom logic and system integration on a single device, reducing external components.
• Substantial I/O Count: 154 I/Os allow broad interfacing options for sensors, peripherals, and board-level interconnects without extensive multiplexing.
• Extended Temperature Operation: Rated from −55°C to 125°C for deployment in thermally challenging environments where consistent operation is required.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) provides a space-efficient solution for compact system boards and dense layouts.
• Regulated Core Voltage Window: Core supply range of 1.425 V to 1.575 V aids in precise power-supply design and management.

Why Choose A3P1000-PQ208M?

The A3P1000-PQ208M positions itself as a military-grade FPGA option that combines large logic capacity, a substantial I/O count, and on-chip memory with formal MIL-STD-883 qualification and an extended operating temperature range. These attributes make it well suited for defense, rugged embedded, and other high-reliability designs that require verified components.

For design teams and procurement organizations needing a high-density ProASIC3 FPGA from Microchip Technology with military qualification and surface-mount packaging, the A3P1000-PQ208M delivers a balance of integration and environmental robustness for long-term deployments.

Request a quote or submit an inquiry to check availability and pricing for the A3P1000-PQ208M and to discuss how it fits your project requirements.