A3P1000-PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 135 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 4 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of A3P1000-PQG208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP
The A3P1000-PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It delivers a fixed hardware resource set—including 24,576 logic elements, approximately 0.147 Mbits of embedded memory and support for up to 154 I/O pins—enabling deterministic, reconfigurable digital logic implementations.
With a 1.425 V to 1.575 V supply window, a 208-BFQFP surface-mount package, and an industrial operating range from −40 °C to 100 °C, this device is specified for designs requiring substantial logic capacity, on-chip RAM, and robust thermal performance.
Key Features
- Logic Capacity — 24,576 logic elements providing a total of 1,000,000 gates for implementing complex digital functions and combinational/sequential logic.
- Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state storage, and small look-up tables.
- I/O Resources — Up to 154 general-purpose I/O pins to interface with external peripherals, sensors, and system buses.
- Power — Core voltage supply range from 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
- Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for board-level integration.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
- Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control — Implement control logic, gating, and protocol bridging where the device’s industrial temperature rating and logic capacity meet system requirements.
- Embedded Systems — Consolidate glue logic, peripheral interfacing, and custom state machines using the available logic elements and on-chip RAM.
- Prototyping & Integration — Evaluate and iterate digital architectures that require up to 1,000,000 gates and flexible I/O count before committing to fixed-function hardware.
Unique Advantages
- Substantial Logic Resources: 24,576 logic elements and 1,000,000 gates allow integration of complex digital functions without external ASICs or multiple CPLDs.
- On-Chip Memory: Approximately 0.147 Mbits of embedded RAM provides local storage for buffers, tables, and state without adding external memory.
- Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
- Compact Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) delivers high pin count in a board-friendly surface-mount package.
- Predictable Power Envelope: Narrow supply window (1.425 V to 1.575 V) simplifies power-supply design and margin planning.
- Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and global market requirements.
Why Choose A3P1000-PQG208I?
The A3P1000-PQG208I positions itself as a robust FPGA option for engineers who need a defined balance of logic density, on-chip memory, and I/O capacity in an industrial-grade package. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 154 I/O pins makes it suitable for designs that demand consolidated digital functionality and reliable thermal performance.
Manufactured by Microchip Technology and supplied in a 208-BFQFP surface-mount package, this device supports long-term deployment where stability, predictable power requirements, and RoHS compliance are required. It is well suited to teams implementing embedded logic, control systems, and prototype architectures that benefit from a fixed, verified FPGA resource set.
Request a quote or submit a pricing and availability inquiry to obtain part-specific lead times and ordering information for the A3P1000-PQG208I.

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