A3P1000-PQG208I

IC FPGA 154 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

Quantity 135 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O154Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of A3P1000-PQG208I – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

The A3P1000-PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It delivers a fixed hardware resource set—including 24,576 logic elements, approximately 0.147 Mbits of embedded memory and support for up to 154 I/O pins—enabling deterministic, reconfigurable digital logic implementations.

With a 1.425 V to 1.575 V supply window, a 208-BFQFP surface-mount package, and an industrial operating range from −40 °C to 100 °C, this device is specified for designs requiring substantial logic capacity, on-chip RAM, and robust thermal performance.

Key Features

  • Logic Capacity — 24,576 logic elements providing a total of 1,000,000 gates for implementing complex digital functions and combinational/sequential logic.
  • Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state storage, and small look-up tables.
  • I/O Resources — Up to 154 general-purpose I/O pins to interface with external peripherals, sensors, and system buses.
  • Power — Core voltage supply range from 1.425 V to 1.575 V to match system power rails and enable predictable power budgeting.
  • Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial temperature environments.
  • Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control — Implement control logic, gating, and protocol bridging where the device’s industrial temperature rating and logic capacity meet system requirements.
  • Embedded Systems — Consolidate glue logic, peripheral interfacing, and custom state machines using the available logic elements and on-chip RAM.
  • Prototyping & Integration — Evaluate and iterate digital architectures that require up to 1,000,000 gates and flexible I/O count before committing to fixed-function hardware.

Unique Advantages

  • Substantial Logic Resources: 24,576 logic elements and 1,000,000 gates allow integration of complex digital functions without external ASICs or multiple CPLDs.
  • On-Chip Memory: Approximately 0.147 Mbits of embedded RAM provides local storage for buffers, tables, and state without adding external memory.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Compact Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) delivers high pin count in a board-friendly surface-mount package.
  • Predictable Power Envelope: Narrow supply window (1.425 V to 1.575 V) simplifies power-supply design and margin planning.
  • Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and global market requirements.

Why Choose A3P1000-PQG208I?

The A3P1000-PQG208I positions itself as a robust FPGA option for engineers who need a defined balance of logic density, on-chip memory, and I/O capacity in an industrial-grade package. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 154 I/O pins makes it suitable for designs that demand consolidated digital functionality and reliable thermal performance.

Manufactured by Microchip Technology and supplied in a 208-BFQFP surface-mount package, this device supports long-term deployment where stability, predictable power requirements, and RoHS compliance are required. It is well suited to teams implementing embedded logic, control systems, and prototype architectures that benefit from a fixed, verified FPGA resource set.

Request a quote or submit a pricing and availability inquiry to obtain part-specific lead times and ordering information for the A3P1000-PQG208I.

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